AMD Xilinx
XCV50E-6FGG256C
XCV50E-6FGG256C ECAD Model
XCV50E-6FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 20736 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 20736 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV50E-6FGG256C Datasheet Download
XCV50E-6FGG256C Overview
The chip model XCV50E-6FGG256C is a powerful, modern integrated circuit (IC) that is used in a variety of applications. It is capable of performing complex calculations and operations quickly and efficiently. This model is designed to be used in a wide range of industries and applications, from consumer electronics to industrial automation and robotics.
The XCV50E-6FGG256C is a low-power, high-performance IC that is designed to be used in embedded systems. It features a wide range of features, such as a high-speed processor, multiple communication interfaces, and a wide array of memory options. This model is also designed to be very reliable and durable, making it suitable for long-term use in a variety of environments.
The XCV50E-6FGG256C is also designed to be used in a wide range of applications. It can be used in consumer electronics, such as smartphones and tablets, as well as in industrial automation and robotics. It is also suitable for use in applications such as machine learning, artificial intelligence, and autonomous systems.
The XCV50E-6FGG256C is a versatile chip model that can be used in many different applications. To use the model effectively, it is important to understand the industry trends of the chip model and the future development of related industries. It is also important to consider whether the application environment requires the support of new technologies.
When it comes to the application of the XCV50E-6FGG256C in the development and popularization of future intelligent robots, it is important to consider the specific design requirements of the model. This includes the types of algorithms, memory, and other features that are necessary for the robot to function. Additionally, it is important to consider the technical talents that are needed to use the model effectively.
When using the XCV50E-6FGG256C, it is important to take into account the actual case studies and precautions that are associated with the model. This includes understanding the potential risks and benefits of using the model, as well as the technical capabilities that are needed to use the model effectively.
Overall, the chip model XCV50E-6FGG256C is a powerful, modern IC that is designed to be used in a variety of applications. To use the model effectively, it is important to understand the industry trends of the chip model and the future development of related industries, as well as consider whether the application environment requires the support of new technologies. Additionally, it is important to consider the specific design requirements of the model, as well as the technical talents that are needed to use the model effectively. Finally, it is important to take into account the actual case studies and precautions that are associated with the model.
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4,180 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23.8757 | $23.8757 |
| 10+ | $23.6190 | $236.1898 |
| 100+ | $22.3353 | $2,233.5336 |
| 1000+ | $21.0517 | $10,525.8480 |
| 10000+ | $19.2546 | $19,254.6000 |
| The price is for reference only, please refer to the actual quotation! | ||