
AMD Xilinx
XCV400E-8BGG560C
XCV400E-8BGG560C ECAD Model
XCV400E-8BGG560C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 404 | |
Number of Outputs | 404 | |
Number of Logic Cells | 10800 | |
Number of Equivalent Gates | 129600 | |
Number of CLBs | 2400 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2400 CLBS, 129600 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B560 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 560 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA560,33X33,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-560 | |
Pin Count | 560 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XCV400E-8BGG560C Datasheet Download
XCV400E-8BGG560C Overview
The XCV400E-8BGG560C chip model is a powerful and versatile model that is suitable for various high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be easily programmable using the Hardware Description Language (HDL). This chip model is designed to provide users with the flexibility to customize their applications to meet their specific needs.
The XCV400E-8BGG560C chip model offers many advantages over other chips. It is designed to be highly efficient and reliable, and it is capable of running complex algorithms quickly and accurately. It uses low-power consumption and is designed to be cost-effective. Additionally, it offers a wide range of features, including multiple clock speeds, multiple memory sizes, and multiple I/O ports.
The demand for the XCV400E-8BGG560C chip model is expected to increase in the future as it is used in a variety of applications. It is ideal for use in embedded systems, such as those used in medical devices, automobiles, and consumer electronics. Additionally, it is suitable for use in high-performance digital signal processing, image processing, and machine learning applications.
The XCV400E-8BGG560C chip model can be applied to the development and popularization of future intelligent robots. It can be used to create sophisticated algorithms that are capable of performing complex tasks. To use the chip model effectively, it is important to have a good understanding of HDL programming and the chip’s features and capabilities. Additionally, knowledge of robotics and artificial intelligence is also beneficial.
In conclusion, the XCV400E-8BGG560C chip model is a powerful and versatile model that is suitable for various high-performance digital signal processing, embedded processing, and image processing applications. It offers many advantages, such as low-power consumption, multiple clock speeds, multiple memory sizes, and multiple I/O ports. Furthermore, it can be used to develop and popularize future intelligent robots. To use the model effectively, it is important to have a good understanding of HDL programming and the chip’s features and capabilities, as well as knowledge of robotics and artificial intelligence.
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