XCV400E-8BGG560C
XCV400E-8BGG560C
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rohs

AMD Xilinx

XCV400E-8BGG560C


XCV400E-8BGG560C
F20-XCV400E-8BGG560C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-560
BGA-560

XCV400E-8BGG560C ECAD Model


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XCV400E-8BGG560C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 404
Number of Outputs 404
Number of Logic Cells 10800
Number of Equivalent Gates 129600
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 129600 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-560
Pin Count 560
Reach Compliance Code unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XCV400E-8BGG560C Datasheet Download


XCV400E-8BGG560C Overview



The XCV400E-8BGG560C chip model is a powerful and versatile model that is suitable for various high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be easily programmable using the Hardware Description Language (HDL). This chip model is designed to provide users with the flexibility to customize their applications to meet their specific needs.


The XCV400E-8BGG560C chip model offers many advantages over other chips. It is designed to be highly efficient and reliable, and it is capable of running complex algorithms quickly and accurately. It uses low-power consumption and is designed to be cost-effective. Additionally, it offers a wide range of features, including multiple clock speeds, multiple memory sizes, and multiple I/O ports.


The demand for the XCV400E-8BGG560C chip model is expected to increase in the future as it is used in a variety of applications. It is ideal for use in embedded systems, such as those used in medical devices, automobiles, and consumer electronics. Additionally, it is suitable for use in high-performance digital signal processing, image processing, and machine learning applications.


The XCV400E-8BGG560C chip model can be applied to the development and popularization of future intelligent robots. It can be used to create sophisticated algorithms that are capable of performing complex tasks. To use the chip model effectively, it is important to have a good understanding of HDL programming and the chip’s features and capabilities. Additionally, knowledge of robotics and artificial intelligence is also beneficial.


In conclusion, the XCV400E-8BGG560C chip model is a powerful and versatile model that is suitable for various high-performance digital signal processing, embedded processing, and image processing applications. It offers many advantages, such as low-power consumption, multiple clock speeds, multiple memory sizes, and multiple I/O ports. Furthermore, it can be used to develop and popularize future intelligent robots. To use the model effectively, it is important to have a good understanding of HDL programming and the chip’s features and capabilities, as well as knowledge of robotics and artificial intelligence.



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