AMD Xilinx
XCV400E-6BGG560C
XCV400E-6BGG560C ECAD Model
XCV400E-6BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV400E-6BGG560C Datasheet Download
XCV400E-6BGG560C Overview
The chip model XCV400E-6BGG560C is a cutting-edge semiconductor chip that has been developed to provide advanced communication systems with a powerful and reliable performance. This chip is based on a new generation of technology that is highly advanced and provides a number of features and benefits to users.
As the chip model XCV400E-6BGG560C is based on a new generation of technology, it has the potential to be upgraded in the future to meet the changing needs of the industry. This chip is designed to provide users with a powerful and reliable performance, as well as a number of features and benefits that make it an ideal choice for communication systems.
The chip model XCV400E-6BGG560C is also designed to be used in a wide range of network applications, as well as being suitable for use in intelligent scenarios. This chip is designed to provide users with a reliable and powerful performance, as well as a number of features and benefits that make it an ideal choice for advanced communication systems.
The chip model XCV400E-6BGG560C is also designed to be used in the era of fully intelligent systems, providing users with a reliable and powerful performance. This chip is designed to provide users with a number of features and benefits that make it an ideal choice for advanced communication systems, as well as being suitable for use in a wide range of network applications.
Overall, the chip model XCV400E-6BGG560C is a cutting-edge semiconductor chip that has been developed to provide advanced communication systems with a powerful and reliable performance. This chip is designed to provide users with a number of features and benefits that make it an ideal choice for networks, intelligent scenarios and advanced communication systems. It has the potential to be upgraded in the future to meet the changing needs of the industry, and is designed to be used in the era of fully intelligent systems.
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2,915 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $85.4494 | $85.4494 |
| 10+ | $84.5306 | $845.3061 |
| 100+ | $79.9366 | $7,993.6557 |
| 1000+ | $75.3425 | $37,671.2510 |
| 10000+ | $68.9108 | $68,910.8250 |
| The price is for reference only, please refer to the actual quotation! | ||