AMD Xilinx
XCV400-6BG560I
XCV400-6BG560I ECAD Model
XCV400-6BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 468252 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 468252 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV400-6BG560I Datasheet Download
XCV400-6BG560I Overview
The chip model XCV400-6BG560I is a revolutionary microprocessor that has been designed to meet the needs of the modern technological world. This chip has been designed to provide a powerful yet efficient platform for a wide range of applications. It is capable of providing high-speed data processing, allowing for faster and more efficient operations.
The XCV400-6BG560I chip model is designed to meet the demands of the modern industry, with its high-performance capabilities, low power consumption and high speed data processing. This chip is also designed to be easily integrated into existing systems, making it an ideal choice for many applications. Additionally, the chip model is designed to be compatible with a variety of different operating systems, making it suitable for a range of different applications.
The XCV400-6BG560I chip model is designed to provide a powerful and efficient platform for a wide range of applications. It is capable of providing high-speed data processing, allowing for faster and more efficient operations. Additionally, the chip model is designed to be easily integrated into existing systems, making it an ideal choice for many applications.
The chip model XCV400-6BG560I is also designed to be compatible with a variety of different operating systems, making it suitable for a range of different applications. This chip is also designed to be easily integrated into existing systems, making it an ideal choice for many applications. Furthermore, the chip model is designed to be compatible with a variety of different operating systems, making it suitable for a range of different applications.
In terms of industry trends, the XCV400-6BG560I chip model is expected to be widely used in the future, as it is designed to meet the demands of the modern industry. The chip model is designed to provide a powerful and efficient platform for a wide range of applications, making it suitable for a variety of different industries. Additionally, the chip model is designed to be easily integrated into existing systems, making it an ideal choice for many applications.
In terms of the application environment, the XCV400-6BG560I chip model is expected to be widely used in the future. This chip is designed to provide a powerful and efficient platform for a wide range of applications, making it suitable for a variety of different industries. Additionally, the chip model is designed to be easily integrated into existing systems, making it an ideal choice for many applications.
In terms of the future development of related industries, the XCV400-6BG560I chip model is expected to be widely used in the future. This chip is designed to provide a powerful and efficient platform for a wide range of applications, making it suitable for a variety of different industries. Additionally, the chip model is designed to be easily integrated into existing systems, making it an ideal choice for many applications.
Whether the XCV400-6BG560I chip model can be applied to the development and popularization of future intelligent robots, it is expected that the model can be used effectively in the development of robots. The chip model is designed to provide a powerful and efficient platform for a wide range of applications, making it suitable for a variety of different industries. Additionally, the chip model is designed to be easily integrated into existing systems, making it an ideal choice for many applications.
In terms of the technical talents needed to use the XCV400-6BG560I chip model effectively, the model requires engineers and technicians who have a strong understanding of the chip model's features and capabilities. Additionally, engineers and technicians need to have the necessary knowledge and experience to properly integrate the chip model into existing systems. Furthermore, engineers and technicians should have the necessary skills to troubleshoot any problems that may arise when using the chip model.
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3,120 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $63.3709 | $63.3709 |
| 10+ | $62.6895 | $626.8954 |
| 100+ | $59.2825 | $5,928.2496 |
| 1000+ | $55.8755 | $27,937.7280 |
| 10000+ | $51.1056 | $51,105.6000 |
| The price is for reference only, please refer to the actual quotation! | ||