AMD Xilinx
XCV300E-8FGG456I
XCV300E-8FGG456I ECAD Model
XCV300E-8FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 312 | |
| Number of Outputs | 312 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA456,22X22,40 | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV300E-8FGG456I Datasheet Download
XCV300E-8FGG456I Overview
Introduction
The XCV300E-8FGG456I chip model is a modern semiconductor device that offers a wide range of features and capabilities to meet the needs of a variety of applications. This chip model was designed with the intention of providing a high-performance, cost-effective solution for advanced communication systems. It is also capable of being upgraded for future applications and is an ideal choice for the development and popularization of future intelligent robots.
This introduction will discuss the original design intention of the XCV300E-8FGG456I chip model, the possibility of future upgrades, and its application to advanced communication systems. In addition, it will provide an overview of the product description and specific design requirements of the chip model, actual case studies, and precautions for using the model effectively. Finally, it will provide an overview of the technical talents needed to use the model effectively in the development and popularization of future intelligent robots.
The XCV300E-8FGG456I chip model was designed with the intention of providing a high-performance, cost-effective solution for advanced communication systems. It is a single-chip solution that combines a high-speed, low-power processor core, an embedded memory controller, and a range of I/O peripherals. The chip model is designed to provide a wide range of features, including an integrated 8-bit processor core, a high-speed memory interface, and a variety of I/O peripherals. It is also capable of being upgraded for future applications, making it an ideal choice for the development and popularization of future intelligent robots.
The product description and specific design requirements of the XCV300E-8FGG456I chip model are provided in the product datasheet. This includes a detailed list of the features and capabilities of the chip model, as well as the recommended operating conditions and usage precautions. In addition, actual case studies of the chip model in use are provided in the product datasheet, allowing users to gain a better understanding of the model's capabilities and limitations.
When using the XCV300E-8FGG456I chip model, there are certain precautions and technical talents that are necessary for effective use. In particular, users should be aware of the chip’s power consumption and thermal characteristics, as well as its software and hardware limitations. Additionally, users should have a solid understanding of the chip’s architecture, as well as its programming language and development environment.
In conclusion, the XCV300E-8FGG456I chip model is a modern semiconductor device that offers a wide range of features and capabilities to meet the needs of a variety of applications. It was designed with the intention of providing a high-performance, cost-effective solution for advanced communication systems, and is capable of being upgraded for future applications. Its product description and specific design requirements, as well as actual case studies and precautions, are provided in the product datasheet. Finally, technical talents are necessary for effective use of the model in the development and popularization of future intelligent robots.
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1,251 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $139.5000 | $139.5000 |
| 10+ | $138.0000 | $1,380.0000 |
| 100+ | $130.5000 | $13,050.0000 |
| 1000+ | $123.0000 | $61,500.0000 |
| 10000+ | $112.5000 | $112,500.0000 |
| The price is for reference only, please refer to the actual quotation! | ||