AMD Xilinx
XCV200E-8FGG456I
XCV200E-8FGG456I ECAD Model
XCV200E-8FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 284 | |
| Number of Outputs | 284 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA456,22X22,40 | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV200E-8FGG456I Datasheet Download
XCV200E-8FGG456I Overview
The XCV200E-8FGG456I chip model is a high-performance, low-power, and cost-effective solution for digital signal processing, embedded processing, image processing, and other applications. It is designed to support the use of HDL language, allowing for the efficient development of complex designs.
The XCV200E-8FGG456I chip model was originally designed with the intention of providing a powerful and flexible solution for a wide range of applications. The chip is capable of being upgraded to support more advanced features and communication systems, making it a great choice for projects that require a high level of performance.
The XCV200E-8FGG456I chip model includes a comprehensive set of features and design requirements. It is capable of handling complex signal processing and image processing tasks with ease. It also supports a wide range of communication protocols and has the ability to interface with external hardware. Additionally, it is designed to be robust and reliable, making it suitable for use in harsh environments.
The XCV200E-8FGG456I chip model has been used in a variety of projects, from medical imaging to robotics. In each case, the chip has been able to provide reliable and efficient performance. It is important to note, however, that the chip is not designed for use in extreme conditions and should be used with caution in such applications.
In conclusion, the XCV200E-8FGG456I chip model is a powerful, cost-effective solution for digital signal processing, embedded processing, image processing, and other applications. It is designed to support the use of HDL language and can be upgraded to support more advanced features and communication systems. It is robust and reliable, making it suitable for use in a variety of projects. However, it should be used with caution in extreme conditions.
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1,714 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $200.3447 | $200.3447 |
| 10+ | $198.1904 | $1,981.9045 |
| 100+ | $187.4192 | $18,741.9228 |
| 1000+ | $176.6480 | $88,324.0040 |
| 10000+ | $161.5683 | $161,568.3000 |
| The price is for reference only, please refer to the actual quotation! | ||