
AMD Xilinx
XCV300E-8FGG256I
XCV300E-8FGG256I ECAD Model
XCV300E-8FGG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 176 | |
Number of Outputs | 176 | |
Number of Logic Cells | 6912 | |
Number of Equivalent Gates | 82944 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 82944 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA256,16X16,40 | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV300E-8FGG256I Datasheet Download
XCV300E-8FGG256I Overview
The XCV300E-8FGG256I chip model is a high-performance, low-power, and easy-to-use integrated circuit. It is designed to meet the needs of a wide range of applications, including consumer, industrial, and automotive. The model is equipped with a wide range of features, including a high-performance processor, a high-speed memory controller, and an efficient power management system.
The XCV300E-8FGG256I chip model has a number of advantages that make it an attractive choice for many applications. For example, the model is designed to be highly reliable and has a low power consumption. It also has a high-speed memory controller, which enables it to process large amounts of data quickly. Additionally, the model is designed to be highly efficient, allowing it to deliver excellent performance with minimal power consumption.
The demand for the XCV300E-8FGG256I chip model is expected to remain strong in the future. This is due to its high performance, low power consumption, and efficient design. Additionally, the model is designed to be compatible with a wide range of applications, making it a versatile choice for many applications.
In order to make the most of the XCV300E-8FGG256I chip model, it is important to understand its product description and design requirements. The model is designed to be highly reliable and to have a low power consumption. It also has a high-speed memory controller, which enables it to process large amounts of data quickly. Additionally, the model is designed to be highly efficient, allowing it to deliver excellent performance with minimal power consumption.
When considering whether the application environment requires the support of new technologies, it is important to consider the specific technologies that are needed. For example, the XCV300E-8FGG256I chip model is designed to be compatible with a wide range of applications. However, if the application requires specific technologies such as advanced security features or a high-speed interface, the model may not be able to meet those requirements.
To ensure that the XCV300E-8FGG256I chip model is used to its full potential, it is important to consider actual case studies and take precautions. For example, it is important to consider the environment in which the model will be used, as well as the specific technologies that are required for the application. Additionally, it is important to consider the expected life cycle of the model and to ensure that it is properly maintained and updated.
In conclusion, the XCV300E-8FGG256I chip model is a high-performance, low-power, and easy-to-use integrated circuit. It is designed to meet the needs of a wide range of applications and is expected to remain in high demand in the future. However, in order to make the most of the model, it is important to understand its product description and design requirements, as well as to consider actual case studies and take precautions.
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1,957 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $346.9086 | $346.9086 |
10+ | $343.1784 | $3,431.7840 |
100+ | $324.5274 | $32,452.7400 |
1000+ | $305.8764 | $152,938.2000 |
10000+ | $279.7650 | $279,765.0000 |
The price is for reference only, please refer to the actual quotation! |