XCV300E-8FGG256I
XCV300E-8FGG256I
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rohs

AMD Xilinx

XCV300E-8FGG256I


XCV300E-8FGG256I
F20-XCV300E-8FGG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

XCV300E-8FGG256I ECAD Model


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XCV300E-8FGG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 176
Number of Outputs 176
Number of Logic Cells 6912
Number of Equivalent Gates 82944
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 82944 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA256,16X16,40
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV300E-8FGG256I Datasheet Download


XCV300E-8FGG256I Overview



The XCV300E-8FGG256I chip model is a high-performance, low-power, and easy-to-use integrated circuit. It is designed to meet the needs of a wide range of applications, including consumer, industrial, and automotive. The model is equipped with a wide range of features, including a high-performance processor, a high-speed memory controller, and an efficient power management system.


The XCV300E-8FGG256I chip model has a number of advantages that make it an attractive choice for many applications. For example, the model is designed to be highly reliable and has a low power consumption. It also has a high-speed memory controller, which enables it to process large amounts of data quickly. Additionally, the model is designed to be highly efficient, allowing it to deliver excellent performance with minimal power consumption.


The demand for the XCV300E-8FGG256I chip model is expected to remain strong in the future. This is due to its high performance, low power consumption, and efficient design. Additionally, the model is designed to be compatible with a wide range of applications, making it a versatile choice for many applications.


In order to make the most of the XCV300E-8FGG256I chip model, it is important to understand its product description and design requirements. The model is designed to be highly reliable and to have a low power consumption. It also has a high-speed memory controller, which enables it to process large amounts of data quickly. Additionally, the model is designed to be highly efficient, allowing it to deliver excellent performance with minimal power consumption.


When considering whether the application environment requires the support of new technologies, it is important to consider the specific technologies that are needed. For example, the XCV300E-8FGG256I chip model is designed to be compatible with a wide range of applications. However, if the application requires specific technologies such as advanced security features or a high-speed interface, the model may not be able to meet those requirements.


To ensure that the XCV300E-8FGG256I chip model is used to its full potential, it is important to consider actual case studies and take precautions. For example, it is important to consider the environment in which the model will be used, as well as the specific technologies that are required for the application. Additionally, it is important to consider the expected life cycle of the model and to ensure that it is properly maintained and updated.


In conclusion, the XCV300E-8FGG256I chip model is a high-performance, low-power, and easy-to-use integrated circuit. It is designed to meet the needs of a wide range of applications and is expected to remain in high demand in the future. However, in order to make the most of the model, it is important to understand its product description and design requirements, as well as to consider actual case studies and take precautions.



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QTY Unit Price Ext Price
1+ $346.9086 $346.9086
10+ $343.1784 $3,431.7840
100+ $324.5274 $32,452.7400
1000+ $305.8764 $152,938.2000
10000+ $279.7650 $279,765.0000
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