
AMD Xilinx
XCV300E-8FGG256C
XCV300E-8FGG256C ECAD Model
XCV300E-8FGG256C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 176 | |
Number of Outputs | 176 | |
Number of Logic Cells | 6912 | |
Number of Equivalent Gates | 82944 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 82944 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA256,16X16,40 | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XCV300E-8FGG256C Datasheet Download
XCV300E-8FGG256C Overview
The chip model XCV300E-8FGG256C is a powerful and versatile device that is revolutionizing the industry. It is designed to meet the needs of a variety of applications, including networking, intelligent systems, and more. Its features and design make it a perfect fit for many industries and applications.
The chip model XCV300E-8FGG256C is a powerful device that provides a range of features and benefits. It is designed to provide high-performance, low-power operation and is capable of supporting a variety of network protocols. It also supports a wide range of intelligent applications, including artificial intelligence and machine learning. In addition, it is designed to be compatible with a variety of operating systems and platforms.
In terms of industry trends, the chip model XCV300E-8FGG256C is expected to be a key component of future networks and intelligent systems. It is designed to enable the development of new technologies and applications. It is also capable of providing the necessary support for the development of new intelligent scenarios.
The product description of the chip model XCV300E-8FGG256C includes a range of features and benefits. It is designed to provide high-performance and low-power operation. It also supports a wide range of network protocols and intelligent applications. It is designed to be compatible with a variety of operating systems and platforms. Additionally, it is designed to be easy to use and maintain.
In terms of actual case studies, the chip model XCV300E-8FGG256C has been successfully used in a range of applications. It has been used in networks to provide high-performance and low-power operation. It has also been used in intelligent systems to enable the development of new technologies and applications. Additionally, it has been used in a variety of other applications, such as robotics, autonomous vehicles, and more.
When considering the use of the chip model XCV300E-8FGG256C, it is important to consider the specific design requirements. It is important to ensure that the chip is compatible with the desired operating system and platform. Additionally, it is important to ensure that the chip is capable of providing the necessary support for the development of new technologies and applications. Furthermore, it is important to ensure that the chip is easy to use and maintain.
Overall, the chip model XCV300E-8FGG256C is a powerful and versatile device that is revolutionizing the industry. It is designed to meet the needs of a variety of applications, including networking, intelligent systems, and more. Its features and design make it a perfect fit for many industries and applications. It is expected to be a key component of future networks and intelligent systems and is capable of providing the necessary support for the development of new technologies and applications. When considering the use of the chip model XCV300E-8FGG256C, it is important to consider the specific design requirements and ensure that the chip is compatible with the desired operating system and platform, capable of providing the necessary support for the development of new technologies and applications, and easy to use and maintain.
You May Also Be Interested In
5,038 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $346.9086 | $346.9086 |
10+ | $343.1784 | $3,431.7840 |
100+ | $324.5274 | $32,452.7400 |
1000+ | $305.8764 | $152,938.2000 |
10000+ | $279.7650 | $279,765.0000 |
The price is for reference only, please refer to the actual quotation! |