XCV300E-8FGG256C
XCV300E-8FGG256C
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rohs

AMD Xilinx

XCV300E-8FGG256C


XCV300E-8FGG256C
F20-XCV300E-8FGG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

XCV300E-8FGG256C ECAD Model


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XCV300E-8FGG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 176
Number of Outputs 176
Number of Logic Cells 6912
Number of Equivalent Gates 82944
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 82944 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA256,16X16,40
Pin Count 256
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XCV300E-8FGG256C Datasheet Download


XCV300E-8FGG256C Overview



The chip model XCV300E-8FGG256C is a powerful and versatile device that is revolutionizing the industry. It is designed to meet the needs of a variety of applications, including networking, intelligent systems, and more. Its features and design make it a perfect fit for many industries and applications.


The chip model XCV300E-8FGG256C is a powerful device that provides a range of features and benefits. It is designed to provide high-performance, low-power operation and is capable of supporting a variety of network protocols. It also supports a wide range of intelligent applications, including artificial intelligence and machine learning. In addition, it is designed to be compatible with a variety of operating systems and platforms.


In terms of industry trends, the chip model XCV300E-8FGG256C is expected to be a key component of future networks and intelligent systems. It is designed to enable the development of new technologies and applications. It is also capable of providing the necessary support for the development of new intelligent scenarios.


The product description of the chip model XCV300E-8FGG256C includes a range of features and benefits. It is designed to provide high-performance and low-power operation. It also supports a wide range of network protocols and intelligent applications. It is designed to be compatible with a variety of operating systems and platforms. Additionally, it is designed to be easy to use and maintain.


In terms of actual case studies, the chip model XCV300E-8FGG256C has been successfully used in a range of applications. It has been used in networks to provide high-performance and low-power operation. It has also been used in intelligent systems to enable the development of new technologies and applications. Additionally, it has been used in a variety of other applications, such as robotics, autonomous vehicles, and more.


When considering the use of the chip model XCV300E-8FGG256C, it is important to consider the specific design requirements. It is important to ensure that the chip is compatible with the desired operating system and platform. Additionally, it is important to ensure that the chip is capable of providing the necessary support for the development of new technologies and applications. Furthermore, it is important to ensure that the chip is easy to use and maintain.


Overall, the chip model XCV300E-8FGG256C is a powerful and versatile device that is revolutionizing the industry. It is designed to meet the needs of a variety of applications, including networking, intelligent systems, and more. Its features and design make it a perfect fit for many industries and applications. It is expected to be a key component of future networks and intelligent systems and is capable of providing the necessary support for the development of new technologies and applications. When considering the use of the chip model XCV300E-8FGG256C, it is important to consider the specific design requirements and ensure that the chip is compatible with the desired operating system and platform, capable of providing the necessary support for the development of new technologies and applications, and easy to use and maintain.



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QTY Unit Price Ext Price
1+ $346.9086 $346.9086
10+ $343.1784 $3,431.7840
100+ $324.5274 $32,452.7400
1000+ $305.8764 $152,938.2000
10000+ $279.7650 $279,765.0000
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