AMD Xilinx
XCV300E-7FGG256I
XCV300E-7FGG256I ECAD Model
XCV300E-7FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV300E-7FGG256I Datasheet Download
XCV300E-7FGG256I Overview
The XCV300E-7FGG256I chip model is a cutting-edge, high-performance model designed to meet the needs of the most demanding applications. It is an advanced, high-performance field programmable gate array (FPGA) that provides a wide range of features and benefits. It is the latest version of the Xilinx Virtex series of FPGAs, offering a high-performance, low-power solution for a variety of applications.
The XCV300E-7FGG256I chip model is designed to provide the highest performance and lowest power consumption in its class. It is capable of providing up to 32.4 Gbps of data throughput, making it ideal for high-speed applications such as wireless communication, video streaming, and other data-intensive applications. It also features a wide range of features such as high-speed I/O, high-speed memory interfaces, and high-speed clock management.
The XCV300E-7FGG256I chip model is expected to experience strong demand in the near future as it is ideal for a variety of applications. It is suitable for use in a wide range of industries, including aerospace, automotive, industrial, medical, and consumer electronics. It is also ideal for use in advanced communication systems, as it is capable of providing high-speed data transmission and low-power consumption.
The XCV300E-7FGG256I chip model is designed to meet the specific needs of its intended applications. It is designed with a variety of features that make it suitable for use in a wide range of applications. For example, it is designed to provide high-speed data transmission, low-power consumption, and high-speed memory interfaces. It also features high-speed I/O and clock management.
The XCV300E-7FGG256I chip model is designed to be easily upgradable and scalable, allowing users to modify and expand its capabilities as needed. It is also designed to be compatible with a variety of communication systems, making it suitable for use in advanced communication systems.
In addition to its features and benefits, the XCV300E-7FGG256I chip model also comes with a variety of precautions that should be taken when using it. For example, it should not be used in a system that is not compatible with its features and capabilities. It should also not be used in a system that is exposed to extreme temperatures or in a system that is not properly shielded.
Overall, the XCV300E-7FGG256I chip model is a cutting-edge, high-performance model designed to meet the needs of the most demanding applications. It is expected to experience strong demand in the near future, as it is ideal for a variety of applications. It is designed to provide the highest performance and lowest power consumption in its class, making it suitable for use in advanced communication systems. It is also designed to be easily upgradable and scalable, allowing users to modify and expand its capabilities as needed. Finally, it comes with a variety of precautions that should be taken when using it, such as not using it in a system that is not compatible with its features and capabilities.
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