AMD Xilinx
XCV300E-7FGG256C
XCV300E-7FGG256C ECAD Model
XCV300E-7FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV300E-7FGG256C Datasheet Download
XCV300E-7FGG256C Overview
The XCV300E-7FGG256C chip model has been designed to provide a wide range of benefits to users in related industries. This chip model is a high-performance, low-power FPGA that is ideal for embedded applications. It is capable of providing high-speed data processing, with a very low power consumption rate. This makes it an ideal choice for applications where power efficiency is paramount.
The XCV300E-7FGG256C chip model is also designed to be highly scalable and customizable, allowing for future upgrades and enhancements. This means that it can be used in a wide range of applications, from basic communication systems to more advanced ones. It is also capable of being used in intelligent scenarios, such as in the era of fully intelligent systems.
In terms of demand trends for the XCV300E-7FGG256C chip model, it is expected that there will be an increasing demand for this type of chip in the future. This is due to its low power consumption rate and its ability to be used in a wide range of applications. Furthermore, the scalability of the chip model makes it ideal for use in intelligent scenarios, such as in the era of fully intelligent systems.
Overall, the XCV300E-7FGG256C chip model is an ideal choice for those looking for a high-performance, low-power FPGA that is capable of being used in a wide range of applications. Its low power consumption rate and scalability make it an ideal choice for use in intelligent scenarios, such as in the era of fully intelligent systems. Furthermore, its ability to be upgraded and enhanced makes it a great choice for those looking for a chip model that can be used in a wide range of applications. As such, it is expected that there will be an increasing demand for this type of chip in the future.
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3,922 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $52.0800 | $52.0800 |
| 10+ | $51.5200 | $515.2000 |
| 100+ | $48.7200 | $4,872.0000 |
| 1000+ | $45.9200 | $22,960.0000 |
| 10000+ | $42.0000 | $42,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||