AMD Xilinx
XCV300E-6FGG256I
XCV300E-6FGG256I ECAD Model
XCV300E-6FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV300E-6FGG256I Datasheet Download
XCV300E-6FGG256I Overview
The XCV300E-6FGG256I chip model is a powerful and versatile model that is suitable for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing and other tasks that require the use of HDL language. As the chip model continues to evolve, it is being used in more and more industries and applications.
In terms of industry trends, the XCV300E-6FGG256I chip model is becoming increasingly popular in a wide range of industries. It is being used in the development of autonomous vehicles, artificial intelligence, and robotics, among other applications. As technology advances, the chip model will continue to be a valuable asset for businesses and individuals looking to stay ahead of the curve.
The XCV300E-6FGG256I chip model is also being used to develop and popularize future intelligent robots. As the demand for robots increases, so too does the demand for the chip model. It is capable of providing the necessary processing power and flexibility needed to make robots smarter and more efficient. To use the chip model effectively, technical talents such as software engineers, hardware engineers, and machine learning experts are required.
Overall, the XCV300E-6FGG256I chip model is an incredibly versatile and powerful chip model that is capable of powering a wide range of applications. As the industry trends continue to evolve, the chip model will remain an invaluable asset for businesses and individuals looking to stay ahead of the curve. With the right technical talents, the chip model can be used to develop and popularize future intelligent robots and other applications.
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4,845 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $50.6288 | $50.6288 |
| 10+ | $50.0844 | $500.8443 |
| 100+ | $47.3625 | $4,736.2452 |
| 1000+ | $44.6405 | $22,320.2360 |
| 10000+ | $40.8297 | $40,829.7000 |
| The price is for reference only, please refer to the actual quotation! | ||