AMD Xilinx
XCV300E-6FGG256C
XCV300E-6FGG256C ECAD Model
XCV300E-6FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV300E-6FGG256C Datasheet Download
XCV300E-6FGG256C Overview
The XCV300E-6FGG256C chip model is a powerful, versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL languages, making it a great choice for a wide variety of applications.
The XCV300E-6FGG256C chip model is equipped with the latest technologies, allowing for high performance and flexibility. It is designed to meet the needs of a variety of industries, including communications, automotive, consumer electronics, and medical. The chip model is also designed to be easily upgradeable, allowing for future upgrades and improvements.
The XCV300E-6FGG256C chip model is an ideal choice for high-performance applications. It is capable of handling complex tasks and is suitable for advanced communication systems. With its powerful features and flexible design, the chip model can be used for a variety of applications, including digital signal processing, embedded processing, and image processing.
The XCV300E-6FGG256C chip model is designed to meet the needs of the industry and is a great choice for those looking to stay ahead of the curve. It is designed to be upgradeable, allowing users to take advantage of new technologies as they become available. The chip model is also designed to be easily upgradable, allowing for future upgrades and improvements.
The XCV300E-6FGG256C chip model is the perfect choice for those looking for a powerful, versatile tool for digital signal processing, embedded processing, and image processing. With its powerful features and flexible design, the chip model can be used for a variety of applications, including digital signal processing, embedded processing, and image processing. It is also designed to be easily upgradeable, allowing users to take advantage of new technologies as they become available. With its powerful features and flexible design, the XCV300E-6FGG256C chip model is the perfect choice for those looking to stay ahead of the curve.
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2,924 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $66.9600 | $66.9600 |
| 10+ | $66.2400 | $662.4000 |
| 100+ | $62.6400 | $6,264.0000 |
| 1000+ | $59.0400 | $29,520.0000 |
| 10000+ | $54.0000 | $54,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||