AMD Xilinx
XCV200E-8FGG256C
XCV200E-8FGG256C ECAD Model
XCV200E-8FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV200E-8FGG256C Datasheet Download
XCV200E-8FGG256C Overview
The chip model XCV200E-8FGG256C is a cutting-edge development in the chip industry, with a wide range of potential applications. It is designed to provide high-speed data processing and storage capabilities, making it an ideal choice for use in networks and other intelligent scenarios. As the technology continues to evolve, this chip model is expected to be used in increasingly sophisticated applications.
The chip model XCV200E-8FGG256C is designed to provide high-performance computing and storage capabilities for a wide range of applications. Its design includes a 256-bit instruction set and a 256-bit data bus, allowing for fast data processing. It also includes a high-speed memory controller, allowing it to access memory at speeds up to 8GB/s. Additionally, the chip model has an integrated network controller, allowing it to access networks quickly and efficiently.
The chip model XCV200E-8FGG256C is designed to be highly reliable and efficient. It is designed to be compatible with a wide range of operating systems, making it a versatile choice for use in many different scenarios. Additionally, it is designed to be energy efficient, allowing it to be used in a wide range of applications without consuming too much power.
The chip model XCV200E-8FGG256C is expected to be used in a wide range of applications, from networks to fully intelligent systems. Its high-performance capabilities make it an ideal choice for use in networks, allowing for fast data processing and storage capabilities. Additionally, its compatibility with a wide range of operating systems makes it suitable for use in fully intelligent systems, allowing for sophisticated applications to be developed.
The product description and specific design requirements of the chip model XCV200E-8FGG256C should be carefully studied before using it in any application. It is important to understand the capabilities of the chip model and the specific requirements for its use. Additionally, actual case studies and other resources should be consulted to ensure the chip model is being used correctly and safely.
In conclusion, the chip model XCV200E-8FGG256C is a cutting-edge development in the chip industry, with a wide range of potential applications. It is designed to provide high-speed data processing and storage capabilities, making it an ideal choice for use in networks and other intelligent scenarios. As the technology continues to evolve, this chip model is expected to be used in increasingly sophisticated applications. However, it is important to understand the product description and specific design requirements of the chip model before using it in any application, as well as to consult actual case studies and other resources to ensure its safe and effective use.
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2,153 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $37.2000 | $37.2000 |
| 10+ | $36.8000 | $368.0000 |
| 100+ | $34.8000 | $3,480.0000 |
| 1000+ | $32.8000 | $16,400.0000 |
| 10000+ | $30.0000 | $30,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||