XCV200E-7FGG256I
XCV200E-7FGG256I
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rohs

AMD Xilinx

XCV200E-7FGG256I


XCV200E-7FGG256I
F20-XCV200E-7FGG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA256,16X16,40
BGA, BGA256,16X16,40

XCV200E-7FGG256I ECAD Model


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XCV200E-7FGG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 176
Number of Outputs 176
Number of Logic Cells 5292
Number of Equivalent Gates 63504
Number of CLBs 1176
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1176 CLBS, 63504 GATES
Clock Frequency-Max 400 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA256,16X16,40
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code EAR99

XCV200E-7FGG256I Datasheet Download


XCV200E-7FGG256I Overview



The XCV200E-7FGG256I chip model is a high-performance, versatile model that is ideal for digital signal processing, embedded processing, and image processing. It requires the use of HDL language. This chip model is well-suited for applications that require complex calculations and manipulation of data such as those found in audio and video processing, robotics, and machine learning.


The XCV200E-7FGG256I is designed with a wide range of features that enable it to perform well in a variety of applications. It is equipped with a 256-bit register file and a 32-bit RISC-V processor. It also has a 32-bit memory interface, a 16-bit DSP core, and a 16-bit instruction-level parallelism (ILP) processor. This chip model also supports various software development tools such as the Vivado Design Suite and the Xilinx SDK.


The XCV200E-7FGG256I chip model has been adopted by many industries due to its powerful capabilities and flexibility. It is used in a variety of applications such as automotive, medical, industrial, and consumer electronics. It is also used in the aerospace, defense, and telecommunications industries.


In order to successfully design and implement the XCV200E-7FGG256I chip model, it is important to understand the product description and specific design requirements. It is also important to be aware of any case studies or precautions that may be applicable to the application environment.


Regarding industry trends and future development, the XCV200E-7FGG256I chip model is expected to continue to be adopted in a variety of applications. As technology advances, new technologies may be required to support the application environment. This could include the use of artificial intelligence, machine learning, or blockchain technology. It is important to keep up with the latest trends in order to stay ahead of the competition and remain competitive in the market.


In conclusion, the XCV200E-7FGG256I chip model is a powerful and versatile model that is well-suited for a variety of applications. It is important to understand the product description and specific design requirements, as well as any case studies or precautions that may be applicable to the application environment. It is also important to stay up to date with industry trends and new technologies in order to remain competitive in the market.



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QTY Unit Price Ext Price
1+ $152.7246 $152.7246
10+ $151.0824 $1,510.8240
100+ $142.8714 $14,287.1400
1000+ $134.6604 $67,330.2000
10000+ $123.1650 $123,165.0000
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