AMD Xilinx
XCV200E-7FGG256C
XCV200E-7FGG256C ECAD Model
XCV200E-7FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV200E-7FGG256C Datasheet Download
XCV200E-7FGG256C Overview
The XCV200E-7FGG256C chip model is a powerful and versatile model that is suitable for a variety of applications. It is capable of carrying out high-performance digital signal processing, embedded processing, and image processing. It also requires the use of HDL language. This makes it a great choice for applications that require high performance and accuracy.
The XCV200E-7FGG256C chip model is designed to meet the needs of modern applications. It has a wide range of features, including high-speed clock frequency and efficient power consumption, making it suitable for a variety of applications. It also supports a variety of development tools, making it easy to use and customize for specific applications.
The industry trends of the XCV200E-7FGG256C chip model are constantly evolving. As technology advances, new technologies are emerging that require support from the XCV200E-7FGG256C chip model. This means that the chip model must be able to keep up with the latest developments in order to remain competitive in the market.
The product description and design requirements of the XCV200E-7FGG256C chip model are detailed in the product documentation. This includes the features and specifications of the chip model, as well as the development tools and resources available. Additionally, the product documentation also provides actual case studies and precautions that should be taken when using the chip model.
In conclusion, the XCV200E-7FGG256C chip model is a powerful and versatile model that is suitable for a variety of applications. It is designed to meet the needs of modern applications, and is capable of keeping up with the latest industry trends and developments. With its detailed product documentation, it is easy to understand and customize for specific applications.
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1,084 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $152.7246 | $152.7246 |
| 10+ | $151.0824 | $1,510.8240 |
| 100+ | $142.8714 | $14,287.1400 |
| 1000+ | $134.6604 | $67,330.2000 |
| 10000+ | $123.1650 | $123,165.0000 |
| The price is for reference only, please refer to the actual quotation! | ||