AMD Xilinx
XCV200E-6FGG256I
XCV200E-6FGG256I ECAD Model
XCV200E-6FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA256,16X16,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 256 |
XCV200E-6FGG256I Datasheet Download
XCV200E-6FGG256I Overview
The XCV200E-6FGG256I chip model is a high-performance, advanced integrated circuit designed to meet the needs of digital signal processing, embedded processing, and image processing. It is designed to be used in combination with a hardware description language (HDL) to provide a variety of features and functions. The original design intention of the chip model was to provide a flexible, yet powerful solution for high-performance applications.
The XCV200E-6FGG256I chip model is designed with a wide range of features and functions that can be used to meet a variety of application requirements. It offers high-performance digital signal processing, embedded processing, and image processing capabilities that make it suitable for a wide range of applications. Additionally, the chip model is designed with the possibility of future upgrades, allowing users to customize their applications and keep up with the latest technology.
The product description of the chip model XCV200E-6FGG256I includes a number of features and functions that make it suitable for a wide range of applications. It offers high-performance digital signal processing, embedded processing, and image processing capabilities that make it suitable for a wide range of applications. Additionally, the chip model is designed with the possibility of future upgrades, allowing users to customize their applications and keep up with the latest technology.
The specific design requirements of the chip model XCV200E-6FGG256I are designed to maximize performance, minimize power consumption, and reduce the overall cost of the device. Additionally, the chip model is designed to be compatible with a wide range of hardware and software platforms, making it suitable for a wide range of applications. Furthermore, the chip model is designed with the possibility of future upgrades, allowing users to customize their applications and keep up with the latest technology.
The XCV200E-6FGG256I chip model is suitable for advanced communication systems, providing high-performance digital signal processing, embedded processing, and image processing capabilities. Additionally, the chip model is designed with the possibility of future upgrades, allowing users to customize their applications and keep up with the latest technology. Furthermore, the chip model is designed to be compatible with a wide range of hardware and software platforms, making it suitable for a wide range of applications.
Case studies and user experiences of the XCV200E-6FGG256I chip model have shown that it is a reliable and powerful integrated circuit. The chip model is designed with the possibility of future upgrades, allowing users to customize their applications and keep up with the latest technology. Additionally, the chip model is designed to be compatible with a wide range of hardware and software platforms, making it suitable for a wide range of applications.
When using the XCV200E-6FGG256I chip model, it is important to follow all safety procedures and guidelines. Additionally, it is important to ensure that the chip model is compatible with the hardware and software platforms that are being used, and that the design requirements are being met. Furthermore, it is important to ensure that the chip model is properly configured and that all necessary updates and upgrades are applied in a timely manner.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||