AMD Xilinx
XCV200E-6FGG256C
XCV200E-6FGG256C ECAD Model
XCV200E-6FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 63504 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 63504 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV200E-6FGG256C Datasheet Download
XCV200E-6FGG256C Overview
The XCV200E-6FGG256C chip model is a powerful and versatile processor that is ideal for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of a HDL language. As such, the XCV200E-6FGG256C chip model is well-suited for the development and popularization of future intelligent robots.
The industry trends for the XCV200E-6FGG256C chip model, as well as the future development of related industries, will depend on the specific technologies needed. As technology advances, the XCV200E-6FGG256C chip model will become increasingly important in the development of intelligent robots and other applications. To use the model effectively, technical talents with a strong understanding of HDL language and other related technologies will be required.
The XCV200E-6FGG256C chip model is a powerful and versatile processor that is capable of handling a wide range of applications. It is well-suited for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of a HDL language. As technology advances, the XCV200E-6FGG256C chip model will become increasingly important in the development of intelligent robots and other applications. The industry trends for the XCV200E-6FGG256C chip model, as well as the future development of related industries, will depend on the specific technologies needed. To use the model effectively, technical talents with a strong understanding of HDL language and other related technologies will be required.
Overall, the XCV200E-6FGG256C chip model is a powerful and versatile processor that is ideal for a wide range of applications. With the right technical talent, it can be used to develop and popularize future intelligent robots. As technology advances, the XCV200E-6FGG256C chip model will become increasingly important in the development of intelligent robots and other applications. To use the model effectively, technical talents with a strong understanding of HDL language and other related technologies will be required.
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|---|---|---|
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