
AMD Xilinx
XCV2000E-8BG560I
XCV2000E-8BG560I ECAD Model
XCV2000E-8BG560I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 404 | |
Number of Outputs | 404 | |
Number of Logic Cells | 43200 | |
Number of Equivalent Gates | 518400 | |
Number of CLBs | 9600 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 9600 CLBS, 518400 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B560 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 560 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA560,33X33,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-560 | |
Pin Count | 560 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCV2000E-8BG560I Datasheet Download
XCV2000E-8BG560I Overview
The XCV2000E-8BG560I is a highly advanced chip model designed for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. This chip model is designed to be used with the HDL (Hardware Description Language) which is a versatile language that is used to create hardware designs.
The XCV2000E-8BG560I is a powerful chip model that offers a number of features that make it suitable for a wide range of applications. It has a wide range of processing capabilities, with high speed and low power consumption. It also has a large memory capacity, which allows for the storage of large amounts of data. Additionally, it has a wide range of I/O interfaces, which makes it easy to connect to external devices.
The product description and specific design requirements of the XCV2000E-8BG560I are provided in detail in the manufacturer’s product documentation. It is important to read and understand the documentation thoroughly in order to ensure that the chip is used correctly and that the design is optimized for the intended application. Additionally, actual case studies can be used to provide a better understanding of the model and its capabilities.
The XCV2000E-8BG560I is a powerful chip model that can be used in the development and popularization of future intelligent robots. It provides the necessary processing power and memory capacity to enable the development of sophisticated robotic systems. In order to use the model effectively, technical talents such as software engineers, hardware engineers and roboticists are needed.
Overall, the XCV2000E-8BG560I is a powerful chip model that is suitable for a wide range of applications. It is important to read and understand the product documentation in order to ensure that the model is used correctly and that the design is optimized for the intended application. Additionally, technical talents such as software engineers, hardware engineers and roboticists are needed in order to use the model effectively in the development and popularization of future intelligent robots.
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4,095 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,305.7200 | $1,305.7200 |
10+ | $1,291.6800 | $12,916.8000 |
100+ | $1,221.4800 | $122,148.0000 |
1000+ | $1,151.2800 | $575,640.0000 |
10000+ | $1,053.0000 | $1,053,000.0000 |
The price is for reference only, please refer to the actual quotation! |