XCV2000E-8BG560I
XCV2000E-8BG560I
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rohs

AMD Xilinx

XCV2000E-8BG560I


XCV2000E-8BG560I
F20-XCV2000E-8BG560I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-560
BGA-560

XCV2000E-8BG560I ECAD Model


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XCV2000E-8BG560I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 404
Number of Outputs 404
Number of Logic Cells 43200
Number of Equivalent Gates 518400
Number of CLBs 9600
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 9600 CLBS, 518400 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-560
Pin Count 560
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCV2000E-8BG560I Datasheet Download


XCV2000E-8BG560I Overview



The XCV2000E-8BG560I is a highly advanced chip model designed for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. This chip model is designed to be used with the HDL (Hardware Description Language) which is a versatile language that is used to create hardware designs.


The XCV2000E-8BG560I is a powerful chip model that offers a number of features that make it suitable for a wide range of applications. It has a wide range of processing capabilities, with high speed and low power consumption. It also has a large memory capacity, which allows for the storage of large amounts of data. Additionally, it has a wide range of I/O interfaces, which makes it easy to connect to external devices.


The product description and specific design requirements of the XCV2000E-8BG560I are provided in detail in the manufacturer’s product documentation. It is important to read and understand the documentation thoroughly in order to ensure that the chip is used correctly and that the design is optimized for the intended application. Additionally, actual case studies can be used to provide a better understanding of the model and its capabilities.


The XCV2000E-8BG560I is a powerful chip model that can be used in the development and popularization of future intelligent robots. It provides the necessary processing power and memory capacity to enable the development of sophisticated robotic systems. In order to use the model effectively, technical talents such as software engineers, hardware engineers and roboticists are needed.


Overall, the XCV2000E-8BG560I is a powerful chip model that is suitable for a wide range of applications. It is important to read and understand the product documentation in order to ensure that the model is used correctly and that the design is optimized for the intended application. Additionally, technical talents such as software engineers, hardware engineers and roboticists are needed in order to use the model effectively in the development and popularization of future intelligent robots.



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Unit Price: $1,404.00
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,305.7200 $1,305.7200
10+ $1,291.6800 $12,916.8000
100+ $1,221.4800 $122,148.0000
1000+ $1,151.2800 $575,640.0000
10000+ $1,053.0000 $1,053,000.0000
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