AMD Xilinx
XCV2000E-7FG860I
XCV2000E-7FG860I ECAD Model
XCV2000E-7FG860I Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Virtex®-E | |
| Package | Tray | |
| Number of LABs/CLBs | 9600 | |
| Number of Logic Elements/Cells | 43200 | |
| Total RAM Bits | 655360 | |
| Number of I/O | 660 | |
| Number of Gates | 2541952 | |
| Voltage - Supply | 1.71V ~ 1.89V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Package / Case | 860-BGA Exposed Pad | |
| Supplier Device Package | 860-FBGA (42.5x42.5) | |
| Base Product Number | XCV2000E |
XCV2000E-7FG860I Datasheet Download
XCV2000E-7FG860I Overview
The XCV2000E-7FG860I is a high-performance, low-power FPGA chip from Xilinx. It is designed for a wide range of applications, including embedded systems, automotive, industrial, medical and aerospace.
The XCV2000E-7FG860I is a low-cost, low-power FPGA chip that offers a high-performance, low-cost solution for a variety of applications. It is equipped with a large number of programmable logic blocks, including 8,000 logic cells, 4,800 flip-flops, and 1,920 multiplexers. It also features a high-speed, low-power embedded SRAM memory and a high-speed, low-power embedded I/O interface.
The XCV2000E-7FG860I is designed for a wide range of applications, including embedded systems, automotive, industrial, medical and aerospace. It is suitable for applications such as motor control, robotics, communications, and digital signal processing. It offers a high-performance solution for a variety of applications, and is ideal for applications requiring high-speed, low-power operation.
The XCV2000E-7FG860I is available in a variety of packages, including a 144-pin PQFP, a 208-pin BGA, a 256-pin BGA, and a 324-pin BGA. It is also available in a variety of temperature ranges, including -40°C to +85°C, -55°C to +125°C, and -40°C to +125°C.
The XCV2000E-7FG860I is a reliable, low-power FPGA chip that offers a high-performance, low-cost solution for a variety of applications. It is suitable for applications such as motor control, robotics, communications, and digital signal processing. It is available in a variety of packages, temperature ranges, and I/O interfaces, making it an ideal choice for a wide range of applications.
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