
AMD Xilinx
XCV2000E-6FG860C
XCV2000E-6FG860C ECAD Model
XCV2000E-6FG860C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-E | |
Package | Tray | |
Number of LABs/CLBs | 9600 | |
Number of Logic Elements/Cells | 43200 | |
Total RAM Bits | 655360 | |
Number of I/O | 660 | |
Number of Gates | 2541952 | |
Voltage - Supply | 1.71V ~ 1.89V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 860-BGA Exposed Pad | |
Supplier Device Package | 860-FBGA (42.5x42.5) | |
Base Product Number | XCV2000E |
XCV2000E-6FG860C Datasheet Download
XCV2000E-6FG860C Overview
The XCV2000E-6FG860C is a high-performance, low-power field-programmable gate array (FPGA) chip designed by Xilinx. It is made up of 860,000 logic cells and 2,000 distributed RAM blocks. It has a maximum operating frequency of up to 500 MHz and a total power consumption of only 4.5 W. It is also equipped with a number of advanced features, such as a high-speed transceiver, a high-density memory interface, and a high-speed serial interface.
The XCV2000E-6FG860C is suitable for a wide range of applications, including data center, storage, and communication systems. It can be used for high-speed data processing, high-bandwidth communication, and high-performance computing. It also provides a flexible platform for high-speed protocol processing, such as Ethernet, Fibre Channel, and InfiniBand.
The XCV2000E-6FG860C is a highly reliable and cost-effective solution for FPGA applications. It is designed to meet the most demanding requirements of today’s data center and communication systems. It is also suitable for applications where maximum performance and low power consumption are required. The chip also offers a wide range of advanced features, such as a high-speed transceiver, a high-density memory interface, and a high-speed serial interface.
In conclusion, the XCV2000E-6FG860C is a powerful and reliable FPGA chip that is suitable for a wide range of applications. It is designed to meet the most demanding requirements of today’s data center and communication systems. It offers a high degree of flexibility and performance, making it an ideal solution for high-speed data processing, high-bandwidth communication, and high-performance computing.
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