AMD Xilinx
XCV1600E-8FG860I
XCV1600E-8FG860I ECAD Model
XCV1600E-8FG860I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-860 | |
| Pin Count | 860 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-8FG860I Datasheet Download
XCV1600E-8FG860I Overview
The XCV1600E-8FG860I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language and is capable of providing the necessary support for advanced communication systems. The chip model is designed with the intention of providing a powerful and reliable processing solution for the industry.
The XCV1600E-8FG860I chip model is designed to be highly versatile and capable of handling a variety of tasks. Its high processing power and low power consumption make it suitable for a wide range of applications. It is capable of providing the necessary support for advanced communication systems and is capable of handling complex tasks such as image processing and digital signal processing.
The chip model is also designed to be upgradable, allowing for future upgrades and enhancements. This allows for the possibility of future upgrades, allowing for the use of new technologies and applications. The chip model is also capable of adapting to the changing needs of the industry, allowing for the development of new technologies and applications.
The XCV1600E-8FG860I chip model is a powerful and reliable tool for the industry. It is capable of providing the necessary support for advanced communication systems and is capable of handling complex tasks such as image processing and digital signal processing. It is designed to be highly versatile and capable of handling a variety of tasks. Its upgradability allows for the possibility of future upgrades and enhancements, allowing for the use of new technologies and applications. It is a powerful and reliable tool for the industry, capable of providing the necessary support for advanced communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||