AMD Xilinx
XCV1000E-8FG860I
XCV1000E-8FG860I ECAD Model
XCV1000E-8FG860I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B860 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 860 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA860,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 2.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-860 | |
| Pin Count | 860 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000E-8FG860I Datasheet Download
XCV1000E-8FG860I Overview
The XCV1000E-8FG860I chip model is a powerful tool for a variety of applications in various industries. This model is designed to provide high performance and reliability, making it a great choice for a range of tasks. The model is designed to be compatible with a wide range of systems, including networking and intelligent scenarios. This makes it an ideal choice for those looking to make the most of their system's capabilities.
The XCV1000E-8FG860I chip model has several advantages over other models. It is designed to be highly reliable and robust, with a long life expectancy. The model is also designed to be compatible with a wide range of systems, making it easy to integrate into existing systems. Furthermore, the model is designed to be energy efficient, allowing for lower operating costs.
The demand for the XCV1000E-8FG860I chip model is expected to grow in the future. This is due to the increasing demand for reliable and robust systems in a variety of industries. This demand is driven by the need for higher performance, greater reliability, and lower operating costs. Furthermore, the model is designed to be compatible with a wide range of systems, making it an ideal choice for those looking to make the most of their system's capabilities.
The XCV1000E-8FG860I chip model can be applied to a range of networks and intelligent scenarios. It is designed to be compatible with a wide range of systems, making it an ideal choice for those looking to make the most of their system's capabilities. The model is also designed to be energy efficient, allowing for lower operating costs. Furthermore, the model is designed to be highly reliable and robust, with a long life expectancy.
The XCV1000E-8FG860I chip model can also be used in the era of fully intelligent systems. This is due to the increasing demand for reliable and robust systems in a variety of industries. Furthermore, the model is designed to be compatible with a wide range of systems, making it an ideal choice for those looking to make the most of their system's capabilities.
The XCV1000E-8FG860I chip model is also applicable to the development and popularization of future intelligent robots. This is due to the model’s compatibility with a wide range of systems, allowing for greater flexibility and scalability. Furthermore, the model is designed to be energy efficient, allowing for lower operating costs.
In order to use the XCV1000E-8FG860I chip model effectively, technical talents are needed. This includes knowledge of system design, programming, and networking. Furthermore, knowledge of hardware and software engineering is also necessary. Additionally, knowledge of artificial intelligence and machine learning is also helpful. With the right technical talents, the XCV1000E-8FG860I chip model can be used to its fullest potential.
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