AMD Xilinx
XCV1600E-8BG560I
XCV1600E-8BG560I ECAD Model
XCV1600E-8BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 34992 | |
| Number of Equivalent Gates | 419904 | |
| Number of CLBs | 7776 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 7776 CLBS, 419904 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV1600E-8BG560I Datasheet Download
XCV1600E-8BG560I Overview
The XCV1600E-8BG560I chip model is a high-performance digital signal processing, embedded processing, and image processing system. It is designed with the intention of providing users with a powerful and versatile system that can be used for a variety of applications. This chip model utilizes the HDL language, which allows for a more efficient and reliable development process.
The XCV1600E-8BG560I chip model is also designed with the possibility of future upgrades in mind. It is capable of being used in advanced communication systems, networks, and intelligent scenarios. This chip model can be used to create systems that are capable of handling complex tasks such as image and video processing, as well as advanced communication systems. Additionally, the XCV1600E-8BG560I chip model can be used in the era of fully intelligent systems, making it a great choice for those looking to create powerful and reliable systems.
The XCV1600E-8BG560I chip model is a great choice for those looking to create powerful and reliable systems. Its ability to be used in advanced communication systems, networks, and intelligent scenarios makes it a great choice for those looking to create powerful and reliable systems. Additionally, its potential for future upgrades and its ability to be used in the era of fully intelligent systems makes it a great choice for those looking to create powerful and reliable systems. With its powerful capabilities, the XCV1600E-8BG560I chip model is a great choice for those looking to create powerful and reliable systems.
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5,421 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,305.7200 | $1,305.7200 |
| 10+ | $1,291.6800 | $12,916.8000 |
| 100+ | $1,221.4800 | $122,148.0000 |
| 1000+ | $1,151.2800 | $575,640.0000 |
| 10000+ | $1,053.0000 | $1,053,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||