AMD Xilinx
XCV1600E-6FG860C
XCV1600E-6FG860C ECAD Model
XCV1600E-6FG860C Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Virtex®-E | |
| Package | Tray | |
| Number of LABs/CLBs | 7776 | |
| Number of Logic Elements/Cells | 34992 | |
| Total RAM Bits | 589824 | |
| Number of I/O | 660 | |
| Number of Gates | 2188742 | |
| Voltage - Supply | 1.71V ~ 1.89V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Package / Case | 860-BGA Exposed Pad | |
| Supplier Device Package | 860-FBGA (42.5x42.5) | |
| Base Product Number | XCV1600E |
XCV1600E-6FG860C Datasheet Download
XCV1600E-6FG860C Overview
The XCV1600E-6FG860C is a Field Programmable Gate Array (FPGA) chip that is manufactured by Xilinx. It is a high-performance, low-power device that is suitable for a wide range of applications.
The XCV1600E-6FG860C has a total of 1600 logic slices and 6.9 million system gates. It has a maximum clock frequency of 500 MHz, and supports up to 860 user I/O pins. It has an operating temperature range of -40°C to 85°C, and a power consumption of up to 8.6 W. The device also features a wide range of memory blocks, including Block RAM, Multi-Port RAM, and FIFO.
The XCV1600E-6FG860C is designed for use in a variety of applications, such as high-speed networking, video and image processing, automotive, and industrial control. It is suitable for applications that require high performance and low power consumption.
The XCV1600E-6FG860C is a reliable and powerful device that can be used for a wide range of applications. It is designed to provide high performance and low power consumption, and is suitable for a variety of applications.
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