AMD Xilinx
XCV100E-8FGG256C
XCV100E-8FGG256C ECAD Model
XCV100E-8FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 32400 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 32400 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV100E-8FGG256C Datasheet Download
XCV100E-8FGG256C Overview
The chip model XCV100E-8FGG256C is a powerful and versatile chip model developed by Xilinx. It is a field programmable gate array (FPGA) that can be used in a variety of applications. It is designed to provide a high-performance, low-power solution for a variety of applications, including industrial automation, medical imaging, communication systems, and intelligent robots.
The XCV100E-8FGG256C chip model offers a variety of features that make it an ideal solution for a variety of applications. It has a high-speed, low-power 8-bit processor core, which allows for fast and efficient data processing. It also has an integrated memory controller, which allows for faster data transfer and storage. It also has a variety of peripherals and interfaces, allowing for easy integration into a variety of systems.
In terms of industry trends, the XCV100E-8FGG256C chip model is expected to be widely used in a variety of industries, including industrial automation, medical imaging, and communication systems. It is also expected to be used in the development and popularization of intelligent robots. The chip model is expected to be used in a variety of applications, including machine learning, artificial intelligence, and robotics.
In terms of the original design intention of the chip model XCV100E-8FGG256C, it was designed to provide a high-performance, low-power solution for a variety of applications. It is also designed to be easily upgradable and customizable, allowing for the development of new applications and technologies. It is also designed to be compatible with a variety of communication systems, allowing for the development of advanced communication systems.
In terms of the future development of the chip model XCV100E-8FGG256C, it is expected to be used in a variety of applications, including machine learning, artificial intelligence, and robotics. It is also expected to be used in the development and popularization of intelligent robots. It is expected to be used in a variety of industries, including industrial automation, medical imaging, and communication systems.
In terms of the technical talents needed to use the XCV100E-8FGG256C chip model effectively, it is important to have a strong understanding of the chip model and its capabilities. It is also important to have a strong understanding of the various communication systems that the chip model is compatible with. It is also important to have a strong understanding of the various applications and technologies that the chip model can be used for.
In conclusion, the chip model XCV100E-8FGG256C is a powerful and versatile chip model that is expected to be widely used in a variety of industries. It is also expected to be used in the development and popularization of intelligent robots. It is important for technical professionals to have a strong understanding of the chip model and its capabilities in order to use it effectively.
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1,108 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $103.1184 | $103.1184 |
| 10+ | $102.0096 | $1,020.0960 |
| 100+ | $96.4656 | $9,646.5600 |
| 1000+ | $90.9216 | $45,460.8000 |
| 10000+ | $83.1600 | $83,160.0000 |
| The price is for reference only, please refer to the actual quotation! | ||