AMD Xilinx
XCV100E-7FGG256I
XCV100E-7FGG256I ECAD Model
XCV100E-7FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 32400 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 32400 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV100E-7FGG256I Datasheet Download
XCV100E-7FGG256I Overview
The chip model XCV100E-7FGG256I is the latest development in semiconductor technology. It is a field programmable gate array (FPGA) that is designed to provide high-performance, low-power processing for a variety of applications. As such, this chip model is of great interest to many industries as they look to the future of computing.
The XCV100E-7FGG256I is a powerful tool that can be used in a variety of applications. In networks, it can be used to provide high-speed data transmission. It can also be used to provide intelligent scenarios, such as machine learning and artificial intelligence. In the era of fully intelligent systems, the XCV100E-7FGG256I can be used to develop and popularize future intelligent robots.
When it comes to industry trends and the future development of related industries, the XCV100E-7FGG256I can be used to support new technologies. For example, the chip model can be used to support 5G technology, edge computing, and the Internet of Things (IoT). It can also be used to support the development of autonomous vehicles, smart homes, and other intelligent systems.
In order to effectively use the XCV100E-7FGG256I, technical talents are needed to understand the chip model and its capabilities. This includes understanding the underlying architecture and the programming languages used to develop applications for the chip model. It also requires knowledge of the latest industry trends and technologies, such as 5G, edge computing, and the IoT.
Overall, the XCV100E-7FGG256I is a powerful tool that can be used in a variety of applications. It can be used to support new technologies and to develop and popularize future intelligent robots. In order to effectively use the chip model, technical talents are needed to understand the underlying architecture and the programming languages used. With the right technical knowledge, the XCV100E-7FGG256I can be an invaluable asset for the future development of related industries.
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