AMD Xilinx
XCV100E-7FGG256C
XCV100E-7FGG256C ECAD Model
XCV100E-7FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 176 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 32400 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 32400 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA256,16X16,40 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV100E-7FGG256C Datasheet Download
XCV100E-7FGG256C Overview
The XCV100E-7FGG256C chip model is a high-performance piece of technology that is suitable for a range of applications, from digital signal processing and embedded processing to image processing. It is designed to be used with HDL language, which is the industry-standard language for hardware description. This chip model offers a number of advantages that make it ideal for use in a variety of industries.
First, the XCV100E-7FGG256C chip model is designed to be highly efficient, with a low power consumption that makes it suitable for a wide range of applications. It also has a high speed, making it ideal for applications that require fast processing. Additionally, the chip model is designed to be highly reliable, with a long life span that makes it suitable for long-term use.
The XCV100E-7FGG256C chip model is also well-suited for a number of industries, including automotive, aerospace, and medical. It is expected that demand for this chip model will continue to grow in these industries, as well as in other industries such as telecommunications and consumer electronics. This is due in part to the chip model's ability to process data quickly and accurately, as well as its low power consumption.
The XCV100E-7FGG256C chip model is also a great choice for use in the development and popularization of future intelligent robots. This is due to the chip model's ability to process data quickly and accurately, as well as its low power consumption. Additionally, the chip model is well-suited for use in robotics applications, as it is designed to be highly reliable and long-lasting.
To use the XCV100E-7FGG256C chip model effectively, it is important to have a good understanding of the HDL language. Additionally, those who wish to use the chip model in robotics applications should have a good understanding of robotics programming and design. Those who have experience in both of these areas will be well-equipped to make the most of the chip model's capabilities.
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