XCV1000E-8BGG560C
XCV1000E-8BGG560C
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rohs

AMD Xilinx

XCV1000E-8BGG560C


XCV1000E-8BGG560C
F20-XCV1000E-8BGG560C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-560
BGA-560

XCV1000E-8BGG560C ECAD Model


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XCV1000E-8BGG560C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 404
Number of Outputs 404
Number of Logic Cells 27648
Number of Equivalent Gates 331776
Number of CLBs 6144
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 6144 CLBS, 331776 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-560
Pin Count 560
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01

XCV1000E-8BGG560C Datasheet Download


XCV1000E-8BGG560C Overview



The XCV1000E-8BGG560C chip model is a powerful and versatile solution for a wide range of digital signal processing, embedded processing and image processing applications. It is designed to provide superior performance and reliability, while also offering a range of features that make it suitable for a variety of tasks. The chip model is designed to be used with the HDL language, making it an ideal choice for applications that require high-performance processing.


The XCV1000E-8BGG560C chip model offers several advantages over other models. It is designed to be highly efficient, allowing for faster processing speeds and lower power consumption. It also provides a wide range of features, including a large number of I/O ports, multiple clock domains, and support for a variety of HDL languages. Additionally, the chip model is designed with a modular architecture, allowing for easy scalability and customization.


The XCV1000E-8BGG560C chip model is expected to be in high demand in the future, as more applications require the use of high-performance digital signal processing, embedded processing, and image processing. The chip model is also expected to be well-suited for applications that require the support of new technologies, such as artificial intelligence and machine learning. The chip model's modular architecture and wide range of features make it an ideal choice for applications that require scalability and customization.


Overall, the XCV1000E-8BGG560C chip model is a powerful and versatile solution for a wide range of applications. It is designed to provide superior performance and reliability, while also offering a range of features that make it suitable for a variety of tasks. The chip model's modular architecture and wide range of features make it an ideal choice for applications that require scalability and customization. It is expected to be in high demand in the future, as more applications require the use of high-performance digital signal processing, embedded processing, and image processing.



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Unit Price: $327.60
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QTY Unit Price Ext Price
1+ $304.6680 $304.6680
10+ $301.3920 $3,013.9200
100+ $285.0120 $28,501.2000
1000+ $268.6320 $134,316.0000
10000+ $245.7000 $245,700.0000
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