
AMD Xilinx
XCV1000E-8BGG560C
XCV1000E-8BGG560C ECAD Model
XCV1000E-8BGG560C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 404 | |
Number of Outputs | 404 | |
Number of Logic Cells | 27648 | |
Number of Equivalent Gates | 331776 | |
Number of CLBs | 6144 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 6144 CLBS, 331776 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B560 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 560 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA560,33X33,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-560 | |
Pin Count | 560 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XCV1000E-8BGG560C Datasheet Download
XCV1000E-8BGG560C Overview
The XCV1000E-8BGG560C chip model is a powerful and versatile solution for a wide range of digital signal processing, embedded processing and image processing applications. It is designed to provide superior performance and reliability, while also offering a range of features that make it suitable for a variety of tasks. The chip model is designed to be used with the HDL language, making it an ideal choice for applications that require high-performance processing.
The XCV1000E-8BGG560C chip model offers several advantages over other models. It is designed to be highly efficient, allowing for faster processing speeds and lower power consumption. It also provides a wide range of features, including a large number of I/O ports, multiple clock domains, and support for a variety of HDL languages. Additionally, the chip model is designed with a modular architecture, allowing for easy scalability and customization.
The XCV1000E-8BGG560C chip model is expected to be in high demand in the future, as more applications require the use of high-performance digital signal processing, embedded processing, and image processing. The chip model is also expected to be well-suited for applications that require the support of new technologies, such as artificial intelligence and machine learning. The chip model's modular architecture and wide range of features make it an ideal choice for applications that require scalability and customization.
Overall, the XCV1000E-8BGG560C chip model is a powerful and versatile solution for a wide range of applications. It is designed to provide superior performance and reliability, while also offering a range of features that make it suitable for a variety of tasks. The chip model's modular architecture and wide range of features make it an ideal choice for applications that require scalability and customization. It is expected to be in high demand in the future, as more applications require the use of high-performance digital signal processing, embedded processing, and image processing.
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3,229 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $304.6680 | $304.6680 |
10+ | $301.3920 | $3,013.9200 |
100+ | $285.0120 | $28,501.2000 |
1000+ | $268.6320 | $134,316.0000 |
10000+ | $245.7000 | $245,700.0000 |
The price is for reference only, please refer to the actual quotation! |