AMD Xilinx
XCV1000E-7BGG560C
XCV1000E-7BGG560C ECAD Model
XCV1000E-7BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV1000E-7BGG560C Datasheet Download
XCV1000E-7BGG560C Overview
The chip model XCV1000E-7BGG560C is a cutting-edge product designed to meet the needs of the modern digital world. It is a high-performance, low-power, and cost-effective chip model with a wide range of applications. It is made of the latest advanced process technology and has a variety of features including high-speed memory, a low-power architecture, and a high-performance processor.
The XCV1000E-7BGG560C chip model is designed to meet the demands of the current digital world. It is capable of supporting a wide range of applications, including artificial intelligence, autonomous vehicles, the Internet of Things, and more. With its high-speed memory, low-power architecture, and high-performance processor, the XCV1000E-7BGG560C is the perfect choice for applications that require the use of advanced technologies.
In terms of industry trends, the XCV1000E-7BGG560C chip model is expected to become increasingly popular in the future due to its ability to support the latest technologies. Its low-power architecture and high-speed memory make it ideal for applications that require the use of advanced technologies, such as artificial intelligence and autonomous vehicles. Additionally, its cost-effectiveness makes it a popular choice among businesses and consumers alike.
The product description of the XCV1000E-7BGG560C chip model includes a variety of features, such as a high-speed memory, a low-power architecture, and a high-performance processor. Additionally, the chip model is designed to be compatible with a wide range of operating systems, such as Linux, Windows, and macOS.
In terms of specific design requirements, the XCV1000E-7BGG560C chip model is designed to meet the needs of the modern digital world. It is capable of supporting a wide range of applications, including artificial intelligence, autonomous vehicles, the Internet of Things, and more. Additionally, the chip model is designed to be compatible with a wide range of operating systems, such as Linux, Windows, and macOS.
In terms of actual case studies, the XCV1000E-7BGG560C chip model has been used in a variety of applications, including artificial intelligence, autonomous vehicles, the Internet of Things, and more. Additionally, it has been used in a wide range of industries, such as automotive, healthcare, and consumer electronics.
Finally, when considering the application environment, it is important to consider the specific technologies needed. For example, if the application requires the use of artificial intelligence, then the XCV1000E-7BGG560C chip model is an ideal choice due to its low-power architecture and high-speed memory. Additionally, if the application requires the use of the Internet of Things, then the XCV1000E-7BGG560C chip model is also a good choice due to its compatibility with a wide range of operating systems.
In conclusion, the XCV1000E-7BGG560C chip model is a cutting-edge product designed to meet the needs of the modern digital world. Its high-speed memory, low-power architecture, and high-performance processor make it the perfect choice for applications that require the use of advanced technologies. Additionally, its cost-effectiveness makes it a popular choice among businesses and consumers alike. When considering the application environment, it is important to consider the specific technologies needed in order to determine whether the XCV1000E-7BGG560C chip model is the best choice.
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4,183 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $418.5000 | $418.5000 |
| 10+ | $414.0000 | $4,140.0000 |
| 100+ | $391.5000 | $39,150.0000 |
| 1000+ | $369.0000 | $184,500.0000 |
| 10000+ | $337.5000 | $337,500.0000 |
| The price is for reference only, please refer to the actual quotation! | ||