
AMD Xilinx
XCV1000E-6FG860I
XCV1000E-6FG860I ECAD Model
XCV1000E-6FG860I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex®-E | |
Package | Tray | |
Number of LABs/CLBs | 6144 | |
Number of Logic Elements/Cells | 27648 | |
Total RAM Bits | 393216 | |
Number of I/O | 660 | |
Number of Gates | 1569178 | |
Voltage - Supply | 1.71V ~ 1.89V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 860-BGA Exposed Pad | |
Supplier Device Package | 860-FBGA (42.5x42.5) | |
Base Product Number | XCV1000E |
XCV1000E-6FG860I Datasheet Download
XCV1000E-6FG860I Overview
The XCV1000E-6FG860I is a high-performance FPGA (Field Programmable Gate Array) chip from Xilinx. It is based on the Virtex-6 FPGA family, and is designed for high-speed, high-performance applications. It has a 6-input, 860-gate array, and is capable of operating at up to 6.5 Gbps.
The XCV1000E-6FG860I has a wide range of features, including 4,096 logic cells, 4,096 flip-flops, 4,096 RAM blocks, and 4,096 DSP slices. It also provides up to 9,216 user I/O pins, and is capable of supporting up to 8 DDR3 memory channels. Additionally, it has two integrated transceivers, which are capable of supporting up to 12.5 Gbps data rates.
The XCV1000E-6FG860I is suitable for a wide range of applications, including high-end embedded systems, consumer electronics, aerospace and defense, industrial automation, and medical applications. It is also suitable for applications that require high speed, high performance, and low power consumption.
Overall, the XCV1000E-6FG860I is an ideal choice for applications that require high speed, high performance, and low power consumption. It is also suitable for a wide range of applications, including embedded systems, consumer electronics, and aerospace and defense.
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