AMD Xilinx
XCV1000E-6BGG560I
XCV1000E-6BGG560I ECAD Model
XCV1000E-6BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV1000E-6BGG560I Datasheet Download
XCV1000E-6BGG560I Overview
The chip model XCV1000E-6BGG560I has become increasingly popular in recent years due to its powerful performance and advanced features. It is a high-performance, low-power, and cost-effective chip that can be used in a variety of applications. It is designed to be used in communication systems and networks, providing reliable and high-speed communication.
The XCV1000E-6BGG560I is a versatile chip that can be used in a variety of applications. It can be used in a wide range of communication systems, including wireless, cellular, and satellite networks. It can also be used in advanced communication systems such as 5G and 6G networks. It is also capable of supporting advanced technologies such as artificial intelligence (AI) and machine learning (ML).
The XCV1000E-6BGG560I is designed to be upgradable and can be used in the future for more advanced communication systems. It is capable of supporting the latest technologies, allowing it to be used in the era of fully intelligent systems. It can be used to build intelligent networks and can be applied to various scenarios, such as autonomous driving, smart homes, and smart cities.
The XCV1000E-6BGG560I is a powerful and versatile chip that can be used in a variety of applications. It is designed to be upgradable, allowing it to be used in the future for more advanced communication systems. It can be used to build intelligent networks and can be applied to various scenarios, such as autonomous driving, smart homes, and smart cities. With its powerful performance, low power consumption, and cost-effectiveness, the XCV1000E-6BGG560I is sure to be an important part of the future of communication systems and networks.
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|---|---|---|
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