AMD Xilinx
XCV1000E-6BGG560C
XCV1000E-6BGG560C ECAD Model
XCV1000E-6BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV1000E-6BGG560C Datasheet Download
XCV1000E-6BGG560C Overview
The XCV1000E-6BGG560C chip model is an advanced and powerful chip model designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language, making it an ideal choice for those who need a strong and reliable processor.
The XCV1000E-6BGG560C chip model is well-suited to the current industry trends, as well as the future development of related industries. It is capable of handling complex tasks, and its ability to utilize HDL language makes it a great choice for those who need a powerful processor. Additionally, its wide range of applications makes it a great choice for those who need a processor that can handle a variety of tasks.
When it comes to the application of the XCV1000E-6BGG560C chip model to the development and popularization of future intelligent robots, it depends on the specific technologies that are needed. The chip model is capable of handling complex tasks, and its ability to utilize HDL language makes it a great choice for those who need a powerful processor. However, the use of the chip model in the development and popularization of future intelligent robots will require the use of additional technologies, such as artificial intelligence, machine learning, and natural language processing.
In order to use the XCV1000E-6BGG560C chip model effectively, technical talents with a strong understanding of HDL language and other relevant technologies are required. Additionally, those who wish to use the chip model for the development and popularization of future intelligent robots should have a strong understanding of artificial intelligence, machine learning, and natural language processing. With the right technical talents and skills, the XCV1000E-6BGG560C chip model can be used to create powerful and reliable intelligent robots.
You May Also Be Interested In
5,531 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $312.4800 | $312.4800 |
| 10+ | $309.1200 | $3,091.2000 |
| 100+ | $292.3200 | $29,232.0000 |
| 1000+ | $275.5200 | $137,760.0000 |
| 10000+ | $252.0000 | $252,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||