AMD Xilinx
XCV1000-6BG560I
XCV1000-6BG560I ECAD Model
XCV1000-6BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 1124022 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 1124022 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000-6BG560I Datasheet Download
XCV1000-6BG560I Overview
The XCV1000-6BG560I chip model is a high-performance digital signal processing, embedded processing and image processing solution. It is designed to be used with the HDL language, which makes it an ideal choice for those who are looking to develop complex and powerful applications. As such, it is possible to see the model being used in a variety of scenarios, ranging from high-performance networks to intelligent systems.
In terms of networks, the XCV1000-6BG560I chip model could be used to develop powerful and reliable networks that are capable of handling a variety of data types and sizes. This could be used to provide better performance for applications such as video streaming, gaming, and other high-bandwidth activities. Additionally, the chip model could be used to create more efficient networks that are able to handle more data at one time.
The chip model could also be used to develop intelligent systems. For example, it could be used to create autonomous robots that are capable of making decisions based on their environment. This could be used to create robots that are able to navigate around obstacles, recognize objects, and even interact with humans. Additionally, the chip model could be used to create intelligent systems that can learn from their environment and adapt to new situations.
Finally, the XCV1000-6BG560I chip model could be used to develop and popularize future intelligent robots. This could be used to create robots that are able to interact with humans in a natural way, as well as robots that are able to perform complex tasks. In order to use the model effectively, it is important to have a good understanding of the HDL language, as well as a strong background in robotics and artificial intelligence. Additionally, it is important to have a good understanding of the hardware and software components of the chip model, as well as an understanding of the various algorithms used in robotics and AI.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $368.7889 | $368.7889 |
| 10+ | $364.8234 | $3,648.2342 |
| 100+ | $344.9961 | $34,499.6064 |
| 1000+ | $325.1687 | $162,584.3520 |
| 10000+ | $297.4104 | $297,410.4000 |
| The price is for reference only, please refer to the actual quotation! | ||