XCR3064XL-7CP56C
XCR3064XL-7CP56C
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rohs

AMD Xilinx

XCR3064XL-7CP56C


XCR3064XL-7CP56C
F20-XCR3064XL-7CP56C
Active
EE PLD, 7.5 ns, 64-Cell, CMOS, 0.50 MM PITCH, CSP-56
0.50 MM PITCH, CSP-56

XCR3064XL-7CP56C ECAD Model


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XCR3064XL-7CP56C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 3.3 V
Propagation Delay 7.5 ns
Number of Macro Cells 64
Number of I/O Lines 48
Programmable Logic Type EE PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 48 I/O
Additional Feature YES
Clock Frequency-Max 119 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 3.3 V
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
JESD-30 Code S-PBGA-B56
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 56
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA56,10X10,20
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 500 µm
Terminal Position BOTTOM
Width 6 mm
Length 6 mm
Seated Height-Max 1.35 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 0.50 MM PITCH, CSP-56
Pin Count 56
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XCR3064XL-7CP56C Datasheet Download


XCR3064XL-7CP56C Overview



The chip model XCR3064XL-7CP56C is a powerful, versatile semiconductor device from Xilinx, Inc. It is designed to provide high-performance, low-power applications for a wide range of industries. It is a high-performance, low-power semiconductor device that is designed to provide a wide range of features, including high-speed data processing, advanced memory management, and high-speed communication.


As technology advances, the chip model XCR3064XL-7CP56C will continue to evolve and become more powerful. This chip model can be used to power a wide range of applications, including networks, intelligent scenarios, and robots. It is also capable of being used in the era of fully intelligent systems.


The chip model XCR3064XL-7CP56C is capable of providing high-speed data processing, advanced memory management, and high-speed communication. It is also capable of providing support for new technologies, such as artificial intelligence, machine learning, and natural language processing. In addition, this chip model can be used to power a wide range of applications, including networks, intelligent scenarios, and robots.


In order to use the chip model XCR3064XL-7CP56C effectively, technical talents are needed. This includes engineers and developers who are knowledgeable in the areas of computer engineering, software engineering, and artificial intelligence. They should also have experience in developing and deploying applications using the chip model.


The chip model XCR3064XL-7CP56C is a powerful, versatile semiconductor device that is capable of powering a wide range of applications. It is capable of providing high-speed data processing, advanced memory management, and high-speed communication. It is also capable of providing support for new technologies, such as artificial intelligence, machine learning, and natural language processing. In addition, this chip model can be used to power a wide range of applications, including networks, intelligent scenarios, and robots. In order to use the chip model XCR3064XL-7CP56C effectively, technical talents are needed. With the right technical expertise and support, this chip model can be used to power the development and popularization of future intelligent robots.



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Unit Price: $8.6801
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QTY Unit Price Ext Price
1+ $8.0725 $8.0725
10+ $7.9857 $79.8569
100+ $7.5517 $755.1687
1000+ $7.1177 $3,558.8410
10000+ $6.5101 $6,510.0750
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