AMD Xilinx
XCR3064XL-6CP56C
XCR3064XL-6CP56C ECAD Model
XCR3064XL-6CP56C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 6 ns | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 48 | |
| Programmable Logic Type | EE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 48 I/O | |
| Additional Feature | YES | |
| Clock Frequency-Max | 192 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B56 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 56 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA56,10X10,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm | |
| Length | 6 mm | |
| Seated Height-Max | 1.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 0.50 MM PITCH, CSP-56 | |
| Pin Count | 56 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCR3064XL-6CP56C Datasheet Download
XCR3064XL-6CP56C Overview
The chip model XCR3064XL-6CP56C is an advanced integrated circuit (IC) that offers a number of advantages over traditional ICs. It is designed to offer high performance, low power consumption, and improved reliability. The model is also capable of supporting a wide range of applications, including networking, robotics, and artificial intelligence (AI).
The demand for the XCR3064XL-6CP56C model is expected to increase in the future, as the need for high-performance, low-power, and reliable ICs grows. This is due to the increasing demand for more advanced and powerful electronic devices. The model is also expected to be used in a variety of applications, such as the Internet of Things (IoT), autonomous vehicles, and other intelligent systems.
The XCR3064XL-6CP56C model is suitable for use in networks and can be applied to a variety of intelligent scenarios. This includes the development of AI-based systems, such as autonomous robots and other intelligent systems. The model is also capable of supporting the development and popularization of future intelligent robots, as it is capable of providing the necessary computing power and reliability.
In order to use the XCR3064XL-6CP56C model effectively, technical talents such as engineers and software developers are needed. These professionals should have a good understanding of the model’s capabilities and how to best utilize them. They should also be able to develop algorithms and software that can be used to effectively control and program the model.
Overall, the XCR3064XL-6CP56C model is an advanced IC that offers a number of advantages over traditional ICs. It is expected to be used in a variety of applications in the future, including networking, robotics, and AI-based systems. In order to effectively use the model, technical talents such as engineers and software developers are needed.
1,784 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $10.8625 | $10.8625 |
| 10+ | $10.7457 | $107.4569 |
| 100+ | $10.1617 | $1,016.1687 |
| 1000+ | $9.5777 | $4,788.8410 |
| 10000+ | $8.7601 | $8,760.0750 |
| The price is for reference only, please refer to the actual quotation! | ||