
AMD Xilinx
XC7VX485T-L2FFG1930E
XC7VX485T-L2FFG1930E ECAD Model
XC7VX485T-L2FFG1930E Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 700 | |
Number of Outputs | 700 | |
Number of Logic Cells | 485760 | |
Number of CLBs | 37950 | |
Combinatorial Delay of a CLB-Max | 610 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 37950 CLBS | |
Clock Frequency-Max | 1.818 GHz | |
Power Supplies | 1,1.8 V | |
Supply Voltage-Max | 1.03 V | |
Supply Voltage-Min | 970 mV | |
JESD-30 Code | S-PBGA-B1930 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 100 °C | |
Number of Terminals | 1930 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1924,44X44,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 3.65 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | FBGA-1930 | |
Pin Count | 1930 | |
ECCN Code | 3A991.D |
XC7VX485T-L2FFG1930E Datasheet Download
XC7VX485T-L2FFG1930E Overview
The XC7VX485T-L2FFG1930E chip model is a high-performance and cost-effective FPGA chip produced by Xilinx. It is designed to meet the needs of various applications, such as network systems, automotive systems, aerospace systems, and industrial control systems. This chip model has a wide range of advantages, including high-speed operation, large memory capacity, low power consumption, and a small form factor.
In the near future, the demand for the XC7VX485T-L2FFG1930E chip model is expected to increase due to its wide range of applications. It can be used in various applications, such as network systems, automotive systems, aerospace systems, and industrial control systems. It is also possible that the chip model can be used in the era of fully intelligent systems, as it has the ability to process data quickly and accurately.
The XC7VX485T-L2FFG1930E chip model is designed to meet the needs of various applications. It features a 7 Series FPGA architecture, which provides a high-performance and low-power solution. It also features a wide range of I/O capabilities, including LVDS, PCIe, and USB. Additionally, it has a built-in high-speed transceiver, which is designed to support the latest high-speed serial protocols.
In order to ensure the successful implementation of the XC7VX485T-L2FFG1930E chip model, it is important to consider the specific design requirements. For example, the chip model must be designed to meet the specific application requirements, such as the number of I/O pins, the type of I/O interface, and the power consumption. Additionally, it is important to consider the environmental conditions, such as temperature and humidity, when designing the chip model.
In addition to considering the design requirements, it is also important to consider actual case studies when implementing the XC7VX485T-L2FFG1930E chip model. For example, in a recent case study, the chip model was successfully used in an automotive system. In this case study, the chip model was used to control a vehicle’s engine and transmission. Additionally, the chip model was used to monitor the vehicle’s performance and to provide feedback to the driver.
Finally, it is important to consider the safety precautions when implementing the XC7VX485T-L2FFG1930E chip model. For example, it is important to ensure that the chip model is properly protected from external sources of interference, such as electromagnetic fields. Additionally, it is important to ensure that the chip model is designed to meet the safety requirements of the application.
The XC7VX485T-L2FFG1930E chip model is a high-performance and cost-effective FPGA chip produced by Xilinx. It is designed to meet the needs of various applications, such as network systems, automotive systems, aerospace systems, and industrial control systems. It is expected that the demand for the chip model will increase in the near future, due to its wide range of applications. Additionally, the chip model can be used in the era of fully intelligent systems, as it has the ability to process data quickly and accurately. In order to ensure the successful implementation of the chip model, it is important to consider the specific design requirements, actual case studies, and safety precautions.
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