AMD Xilinx
XC7VX485T-3FFG1930E
XC7VX485T-3FFG1930E ECAD Model
XC7VX485T-3FFG1930E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 700 | |
| Number of Outputs | 700 | |
| Number of Logic Cells | 485760 | |
| Number of CLBs | 37950 | |
| Combinatorial Delay of a CLB-Max | 580 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 37950 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B1930 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Operating Temperature-Max | 100 °C | |
| Number of Terminals | 1930 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1924,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | FBGA-1930 | |
| Pin Count | 1930 | |
| ECCN Code | 3A991.D |
XC7VX485T-3FFG1930E Datasheet Download
XC7VX485T-3FFG1930E Overview
The XC7VX485T-3FFG1930E is a versatile and powerful chip model that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL (Hardware Description Language) language, making it an ideal choice for those looking for a reliable and efficient chip model.
The chip model is becoming increasingly popular as it allows for high performance and flexibility. It is also becoming increasingly important in the industry for its ability to be used in advanced communication systems. This chip model can be used for a variety of applications, allowing for a wide range of possibilities for future development.
The original design intention of the XC7VX485T-3FFG1930E was to provide a reliable and efficient solution for a variety of applications. The chip model is designed to be highly efficient and can be used in a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is also designed to be easily upgradable, allowing for future upgrades and enhancements.
The chip model is also designed to be compatible with new technologies, allowing for the use of new technologies in the application environment. This ensures that the chip model can be used in the most advanced communication systems. It is also designed to be compatible with a variety of other technologies, such as the HDL language, making it an ideal choice for those looking for a reliable and efficient chip model.
The XC7VX485T-3FFG1930E is becoming increasingly popular due to its versatility and powerful capabilities. It is also becoming increasingly important in the industry for its ability to be used in advanced communication systems. It is designed to be reliable and efficient, allowing for a wide range of possibilities for future development. It is also designed to be compatible with new technologies, allowing for the use of new technologies in the application environment. This ensures that the chip model can be used in the most advanced communication systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||