
AMD Xilinx
XC7272A-25PC84I
XC7272A-25PC84I ECAD Model
XC7272A-25PC84I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 40 ns | |
Number of Dedicated Inputs | 12 | |
Number of Macro Cells | 72 | |
Number of I/O Lines | 42 | |
Programmable Logic Type | OT PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 12 DEDICATED INPUTS, 42 I/O | |
Additional Feature | PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS | |
Clock Frequency-Max | 40 MHz | |
In-System Programmable | NO | |
JTAG BST | NO | |
Output Function | MACROCELL | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQCC-J84 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 84 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC84,1.2SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 29.3116 mm | |
Length | 29.3116 mm | |
Seated Height-Max | 5.08 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | LCC | |
Package Description | PLASTIC, MO-047AF, LCC-84 | |
Pin Count | 84 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC7272A-25PC84I Datasheet Download
XC7272A-25PC84I Overview
The XC7272A-25PC84I chip model is a powerful, high-performance digital signal processor with embedded processing capabilities. It is designed to be used in a wide range of applications, including image processing, digital signal processing, and other related tasks. The chip model is designed to be compatible with a wide range of hardware platforms and can be programmed using the HDL language.
The XC7272A-25PC84I chip model is designed to meet the specific needs of the industry, and is capable of delivering high-performance results. It is designed to be compatible with a wide range of hardware platforms, including FPGA, ASIC, and other related technologies. It is also compatible with the latest technologies, such as the Internet of Things, Artificial Intelligence, and Machine Learning.
The product description of the XC7272A-25PC84I chip model includes detailed specifications of the chip, its features, and its performance. It also includes information about the design requirements for the chip, including the use of HDL language, the power requirements, the memory requirements, and other related technical details. Additionally, it includes information about the actual case studies and precautions when using the chip.
The XC7272A-25PC84I chip model is designed to be used in a wide range of industries, including automotive, medical, industrial, and consumer electronics. It is designed to provide high-performance results while being energy-efficient. The chip model is designed to be compatible with the latest technologies, such as the Internet of Things, Artificial Intelligence, and Machine Learning, allowing for the use of these technologies in the application environment.
In terms of industry trends and the future development of related industries, the XC7272A-25PC84I chip model is designed to be compatible with the latest technologies, such as the Internet of Things, Artificial Intelligence, and Machine Learning. This allows for the use of these technologies in the application environment, and provides the necessary support for the development of these industries. As new technologies become available, the chip model will be able to keep up with these trends and support the development of related industries.
Overall, the XC7272A-25PC84I chip model is an excellent choice for applications that require high-performance digital signal processing, embedded processing, and image processing. It is designed to be compatible with a wide range of hardware platforms, and is designed to be compatible with the latest technologies, such as the Internet of Things, Artificial Intelligence, and Machine Learning. The product description of the chip model includes detailed specifications, design requirements, and actual case studies and precautions when using the chip. The chip model is designed to be used in a wide range of industries, and is designed to provide high-performance results while being energy-efficient.
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2,497 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $29.2838 | $29.2838 |
10+ | $28.9690 | $289.6896 |
100+ | $27.3946 | $2,739.4560 |
1000+ | $25.8202 | $12,910.0800 |
10000+ | $23.6160 | $23,616.0000 |
The price is for reference only, please refer to the actual quotation! |