AMD Xilinx
XC7272A-25PC84C
XC7272A-25PC84C ECAD Model
XC7272A-25PC84C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 40 ns | |
| Number of Dedicated Inputs | 12 | |
| Number of Macro Cells | 72 | |
| Number of I/O Lines | 42 | |
| Programmable Logic Type | OT PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 12 DEDICATED INPUTS, 42 I/O | |
| Additional Feature | PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS | |
| Clock Frequency-Max | 40 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, MO-047AF, LCC-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC7272A-25PC84C Datasheet Download
XC7272A-25PC84C Overview
The XC7272A-25PC84C chip model is a highly advanced chip model that has been developed for a variety of communication systems. It has been designed to provide a high level of performance and reliability for a wide range of applications. This chip model is capable of providing the highest level of performance and reliability for various communication systems, such as wireless communication systems, cellular networks, and other applications.
The XC7272A-25PC84C chip model has been designed to provide a high level of performance and reliability while also being cost-effective. This chip model is capable of providing a high level of performance and reliability while also being cost-effective. This chip model is also capable of providing a high level of scalability, allowing it to be used in a variety of applications.
The XC7272A-25PC84C chip model is highly advanced and is expected to be in high demand in the future. This chip model has been designed to provide a high level of performance and reliability while also being cost-effective. This chip model is also capable of providing a high level of scalability, allowing it to be used in a variety of applications. This chip model is also capable of providing a high level of scalability, allowing it to be used in a variety of applications.
The XC7272A-25PC84C chip model is also capable of being upgraded in the future, allowing it to be used in more advanced communication systems. This chip model is also capable of being used in a variety of networks, such as wireless communication systems, cellular networks, and other applications. This chip model is also capable of being used in intelligent scenarios, such as in the era of fully intelligent systems.
The XC7272A-25PC84C chip model is highly advanced and is expected to be in high demand in the future. This chip model is expected to be used in a variety of applications, such as wireless communication systems, cellular networks, and other applications. This chip model is also expected to be used in intelligent scenarios, such as in the era of fully intelligent systems. This chip model is also expected to be used in a variety of networks, such as wireless communication systems, cellular networks, and other applications.
Overall, the XC7272A-25PC84C chip model is a highly advanced chip model that has been designed to provide a high level of performance and reliability while also being cost-effective. This chip model is expected to be in high demand in the future and is capable of being used in a variety of applications, such as wireless communication systems, cellular networks, and other applications. This chip model is also capable of being upgraded in the future and is capable of being used in intelligent scenarios, such as in the era of fully intelligent systems.
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1,126 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $29.2838 | $29.2838 |
| 10+ | $28.9690 | $289.6896 |
| 100+ | $27.3946 | $2,739.4560 |
| 1000+ | $25.8202 | $12,910.0800 |
| 10000+ | $23.6160 | $23,616.0000 |
| The price is for reference only, please refer to the actual quotation! | ||