
AMD Xilinx
XC7272A-20PC84C
XC7272A-20PC84C ECAD Model
XC7272A-20PC84C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 32 ns | |
Number of Dedicated Inputs | 12 | |
Number of Macro Cells | 72 | |
Number of I/O Lines | 42 | |
Programmable Logic Type | OT PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 12 DEDICATED INPUTS, 42 I/O | |
Additional Feature | PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS | |
Clock Frequency-Max | 50 MHz | |
In-System Programmable | NO | |
JTAG BST | NO | |
Output Function | MACROCELL | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQCC-J84 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 84 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC84,1.2SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 29.3116 mm | |
Length | 29.3116 mm | |
Seated Height-Max | 5.08 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | PLASTIC, MO-047AF, LCC-84 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Part Package Code | LCC | |
Pin Count | 84 |
XC7272A-20PC84C Datasheet Download
XC7272A-20PC84C Overview
The XC7272A-20PC84C chip model is a powerful tool for high-performance digital signal processing, embedded processing, image processing, and other related applications. It is designed to be used with the HDL language, allowing developers to create sophisticated solutions for their projects. The model provides a wide range of features, including high-speed processing, high-resolution image processing, and more.
The XC7272A-20PC84C chip model has a number of advantages that make it one of the most sought-after models in the industry. It has a low power consumption, making it energy-efficient and cost-effective. Additionally, its high-speed processing capabilities make it ideal for applications requiring fast response times. Furthermore, its high-resolution image processing capabilities make it suitable for applications such as medical imaging, surveillance, and more.
The future demand for the XC7272A-20PC84C chip model is expected to be quite high. As the need for digital signal processing, embedded processing, and image processing increases, the demand for this model will only increase. In addition, the chip model is expected to be used in many applications in the field of networks and intelligent systems. Its high-speed processing and image processing capabilities make it ideal for use in intelligent systems such as facial recognition, object recognition, and more.
The XC7272A-20PC84C chip model is expected to be widely used in the era of fully intelligent systems. Its high-speed processing and image processing capabilities make it suitable for use in a variety of intelligent scenarios. For example, it can be used in facial recognition systems, object recognition systems, and more. Additionally, its low power consumption makes it energy-efficient and cost-effective, making it ideal for use in fully intelligent systems.
In conclusion, the XC7272A-20PC84C chip model is an ideal choice for high-performance digital signal processing, embedded processing, image processing, and other related applications. Its low power consumption, high-speed processing, and high-resolution image processing capabilities make it suitable for use in a variety of intelligent scenarios. Furthermore, its expected demand in the future makes it a great choice for use in fully intelligent systems.
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