
AMD Xilinx
XC6VSX475T-2FF1156I
XC6VSX475T-2FF1156I ECAD Model
XC6VSX475T-2FF1156I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 476160 | |
Combinatorial Delay of a CLB-Max | 4.29 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.286 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, FBGA-1156 | |
Pin Count | 1156 |
XC6VSX475T-2FF1156I Datasheet Download
XC6VSX475T-2FF1156I Overview
The chip model XC6VSX475T-2FF1156I is a cutting edge technology in the semiconductor industry. It is a field-programmable gate array (FPGA) with a high-performance, low-power, low-cost architecture. It is designed for applications that require high-speed, low-power, and low-cost solutions. It is also suitable for applications such as image processing, video processing, and high-speed communication.
The industry trends of the chip model XC6VSX475T-2FF1156I indicate that the technology is becoming more popular. It is being used in a variety of applications, from high-speed networking to embedded systems. As the technology continues to evolve, it will become more efficient and cost-effective.
In terms of the future development of related industries, the chip model XC6VSX475T-2FF1156I will likely be used in a variety of intelligent scenarios. It can be used in the development and popularization of future intelligent robots, as well as in the development of fully intelligent systems. In order to use the model effectively, specialized technical talents are needed.
In terms of the application environment, the chip model XC6VSX475T-2FF1156I can be used in networks and can be applied to a variety of intelligent scenarios. It is also possible to use the model in the era of fully intelligent systems. The technologies needed to use the model effectively will depend on the specific application.
In conclusion, the chip model XC6VSX475T-2FF1156I is a cutting-edge technology in the semiconductor industry. It is becoming increasingly popular and is being used in a variety of applications. The industry trends of the chip model indicate that it will continue to be used in the development and popularization of future intelligent robots, as well as in the development of fully intelligent systems. The application environment will require the support of new technologies, which will depend on the specific application. In order to use the model effectively, specialized technical talents are needed.
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1,607 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $14,800.0914 | $14,800.0914 |
10+ | $14,640.9507 | $146,409.5066 |
100+ | $13,845.2468 | $1,384,524.6816 |
1000+ | $13,049.5430 | $6,524,771.4880 |
10000+ | $11,935.5576 | $11,935,557.6000 |
The price is for reference only, please refer to the actual quotation! |