XC6VSX475T-2FF1156I
XC6VSX475T-2FF1156I
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rohs

AMD Xilinx

XC6VSX475T-2FF1156I


XC6VSX475T-2FF1156I
F20-XC6VSX475T-2FF1156I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, FBGA-1156
35 X 35 MM, FBGA-1156

XC6VSX475T-2FF1156I ECAD Model


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XC6VSX475T-2FF1156I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 476160
Combinatorial Delay of a CLB-Max 4.29 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.286 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 35 X 35 MM, FBGA-1156
Pin Count 1156

XC6VSX475T-2FF1156I Datasheet Download


XC6VSX475T-2FF1156I Overview



The chip model XC6VSX475T-2FF1156I is a cutting edge technology in the semiconductor industry. It is a field-programmable gate array (FPGA) with a high-performance, low-power, low-cost architecture. It is designed for applications that require high-speed, low-power, and low-cost solutions. It is also suitable for applications such as image processing, video processing, and high-speed communication.


The industry trends of the chip model XC6VSX475T-2FF1156I indicate that the technology is becoming more popular. It is being used in a variety of applications, from high-speed networking to embedded systems. As the technology continues to evolve, it will become more efficient and cost-effective.


In terms of the future development of related industries, the chip model XC6VSX475T-2FF1156I will likely be used in a variety of intelligent scenarios. It can be used in the development and popularization of future intelligent robots, as well as in the development of fully intelligent systems. In order to use the model effectively, specialized technical talents are needed.


In terms of the application environment, the chip model XC6VSX475T-2FF1156I can be used in networks and can be applied to a variety of intelligent scenarios. It is also possible to use the model in the era of fully intelligent systems. The technologies needed to use the model effectively will depend on the specific application.


In conclusion, the chip model XC6VSX475T-2FF1156I is a cutting-edge technology in the semiconductor industry. It is becoming increasingly popular and is being used in a variety of applications. The industry trends of the chip model indicate that it will continue to be used in the development and popularization of future intelligent robots, as well as in the development of fully intelligent systems. The application environment will require the support of new technologies, which will depend on the specific application. In order to use the model effectively, specialized technical talents are needed.



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Unit Price: $15,914.0768
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Pricing (USD)

QTY Unit Price Ext Price
1+ $14,800.0914 $14,800.0914
10+ $14,640.9507 $146,409.5066
100+ $13,845.2468 $1,384,524.6816
1000+ $13,049.5430 $6,524,771.4880
10000+ $11,935.5576 $11,935,557.6000
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