AMD Xilinx
XC6VSX475T-2FF1156C
XC6VSX475T-2FF1156C ECAD Model
XC6VSX475T-2FF1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 476160 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 35 X 35 MM, FBGA-1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 1156 |
XC6VSX475T-2FF1156C Datasheet Download
XC6VSX475T-2FF1156C Overview
The XC6VSX475T-2FF1156C is a powerful chip model with a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. The chip model requires the use of HDL language for programming and development.
The XC6VSX475T-2FF1156C has numerous advantages that make it an ideal choice for many industries. It has a high level of performance, making it suitable for many high-demand tasks. It is also highly efficient, consuming less energy than other chip models. Additionally, the chip model is highly reliable and has a long lifespan, making it a cost-effective choice for many businesses.
The demand for the XC6VSX475T-2FF1156C is expected to grow in the future as more industries adopt it for their tasks. The chip model is already being used in many industries such as automotive, aerospace, medical, and consumer electronics. As more businesses require the use of the chip model, the demand for it is expected to increase.
The application environment of the XC6VSX475T-2FF1156C may require the support of new technologies in the future. This will depend on the specific tasks that businesses need the chip model for. For example, if businesses need the chip model for image processing, then they may need to use new technologies such as artificial intelligence and machine learning.
Overall, the XC6VSX475T-2FF1156C is a powerful chip model with a wide range of applications. It is suitable for many industries and is expected to be in high demand in the future. As more businesses require the use of the chip model, the application environment may require the support of new technologies.
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5,138 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,466.6902 | $8,466.6902 |
| 10+ | $8,375.6506 | $83,756.5056 |
| 100+ | $7,920.4522 | $792,045.2160 |
| 1000+ | $7,465.2538 | $3,732,626.8800 |
| 10000+ | $6,827.9760 | $6,827,976.0000 |
| The price is for reference only, please refer to the actual quotation! | ||