
AMD Xilinx
XC6VSX315T-L1FF1156C
XC6VSX315T-L1FF1156C ECAD Model
XC6VSX315T-L1FF1156C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 314880 | |
Combinatorial Delay of a CLB-Max | 5.87 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, FBGA-1156 | |
Pin Count | 1156 | |
ECCN Code | 3A991.D |
XC6VSX315T-L1FF1156C Datasheet Download
XC6VSX315T-L1FF1156C Overview
The XC6VSX315T-L1FF1156C chip model is a high-performance and cost-effective solution for a variety of applications. It has the advantages of a low power consumption, high speed, and a wide range of applications. Its design intention is to provide a highly integrated, low-cost, and high-performance solution for a variety of applications. It is suitable for use in a variety of embedded systems, such as digital signal processing, communication systems, and industrial control systems.
The XC6VSX315T-L1FF1156C chip model has a wide range of applications and is expected to be in high demand in the future. It is suitable for use in various industries, such as automotive, industrial, and consumer electronics. As these industries continue to develop and become more complex, the demand for the XC6VSX315T-L1FF1156C chip model will continue to increase.
The XC6VSX315T-L1FF1156C chip model has the potential for future upgrades and can be used in advanced communication systems. It is capable of supporting a wide range of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. This makes it suitable for use in a variety of applications, such as home automation systems, smart home systems, and industrial control systems.
The XC6VSX315T-L1FF1156C chip model can also be used in the development and popularization of future intelligent robots. It is capable of supporting a wide range of programming languages, such as C, C++, and Python. This makes it suitable for use in a variety of applications, such as robotic control systems, autonomous vehicles, and artificial intelligence. To effectively use the XC6VSX315T-L1FF1156C chip model, technical talents such as software engineers, electrical engineers, and roboticists are needed.
In conclusion, the XC6VSX315T-L1FF1156C chip model is a high-performance and cost-effective solution for a variety of applications. It has the advantages of a low power consumption, high speed, and a wide range of applications. It is expected to be in high demand in the future and has the potential for future upgrades. It can be used in advanced communication systems and in the development and popularization of future intelligent robots. To effectively use the XC6VSX315T-L1FF1156C chip model, technical talents such as software engineers, electrical engineers, and roboticists are needed.
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QTY | Unit Price | Ext Price |
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