XC6VSX315T-L1FF1156C
XC6VSX315T-L1FF1156C
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rohs

AMD Xilinx

XC6VSX315T-L1FF1156C


XC6VSX315T-L1FF1156C
F20-XC6VSX315T-L1FF1156C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, FBGA-1156
35 X 35 MM, FBGA-1156

XC6VSX315T-L1FF1156C ECAD Model


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XC6VSX315T-L1FF1156C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 314880
Combinatorial Delay of a CLB-Max 5.87 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 35 X 35 MM, FBGA-1156
Pin Count 1156
ECCN Code 3A991.D

XC6VSX315T-L1FF1156C Datasheet Download


XC6VSX315T-L1FF1156C Overview



The XC6VSX315T-L1FF1156C chip model is a high-performance and cost-effective solution for a variety of applications. It has the advantages of a low power consumption, high speed, and a wide range of applications. Its design intention is to provide a highly integrated, low-cost, and high-performance solution for a variety of applications. It is suitable for use in a variety of embedded systems, such as digital signal processing, communication systems, and industrial control systems.


The XC6VSX315T-L1FF1156C chip model has a wide range of applications and is expected to be in high demand in the future. It is suitable for use in various industries, such as automotive, industrial, and consumer electronics. As these industries continue to develop and become more complex, the demand for the XC6VSX315T-L1FF1156C chip model will continue to increase.


The XC6VSX315T-L1FF1156C chip model has the potential for future upgrades and can be used in advanced communication systems. It is capable of supporting a wide range of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. This makes it suitable for use in a variety of applications, such as home automation systems, smart home systems, and industrial control systems.


The XC6VSX315T-L1FF1156C chip model can also be used in the development and popularization of future intelligent robots. It is capable of supporting a wide range of programming languages, such as C, C++, and Python. This makes it suitable for use in a variety of applications, such as robotic control systems, autonomous vehicles, and artificial intelligence. To effectively use the XC6VSX315T-L1FF1156C chip model, technical talents such as software engineers, electrical engineers, and roboticists are needed.


In conclusion, the XC6VSX315T-L1FF1156C chip model is a high-performance and cost-effective solution for a variety of applications. It has the advantages of a low power consumption, high speed, and a wide range of applications. It is expected to be in high demand in the future and has the potential for future upgrades. It can be used in advanced communication systems and in the development and popularization of future intelligent robots. To effectively use the XC6VSX315T-L1FF1156C chip model, technical talents such as software engineers, electrical engineers, and roboticists are needed.



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