AMD Xilinx
XC6VLX75T-L1FF784C
XC6VLX75T-L1FF784C ECAD Model
XC6VLX75T-L1FF784C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 74496 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, FBGA-784 | |
| Pin Count | 784 | |
| ECCN Code | 3A991.D |
XC6VLX75T-L1FF784C Datasheet Download
XC6VLX75T-L1FF784C Overview
The XC6VLX75T-L1FF784C chip model is one of the most advanced and powerful FPGA (Field Programmable Gate Array) chips available in the current market. It is designed to offer a high level of performance and scalability, making it a preferred choice for many applications in various industries.
The XC6VLX75T-L1FF784C chip model has several advantages that make it an attractive choice for many applications. It is designed with a low-power, high-performance architecture that can support multiple clock speeds and wide range of I/O configurations. It is also equipped with advanced features such as advanced error correction and built-in self-test capabilities. The chip model also offers a high level of programmability and flexibility, allowing users to customize their applications according to their needs.
The demand for the XC6VLX75T-L1FF784C chip model is expected to continue to grow in the future as it is increasingly being used in various industries. It is being used in the telecommunications industry for high-speed data transmission, in the automotive industry for advanced driver assistance systems, and in the aerospace industry for navigation and control systems. It is also being used in the medical industry for the development of medical devices and in the consumer electronics industry for the development of smart home appliances.
The XC6VLX75T-L1FF784C chip model is well-suited for use in networks and can be used in a variety of intelligent scenarios. It can be used for the development of intelligent systems for the Internet of Things (IoT) and for the development of autonomous vehicles. It can also be used for the development of artificial intelligence (AI) systems, such as natural language processing, deep learning, and computer vision.
The product description and specific design requirements of the XC6VLX75T-L1FF784C chip model include a wide range of features, including a low-power, high-performance architecture, advanced error correction, and built-in self-test capabilities. It is also equipped with a wide range of I/O configurations and can support multiple clock speeds. It is also designed to be highly programmable and flexible, allowing users to customize their applications according to their needs.
Case studies of the XC6VLX75T-L1FF784C chip model have demonstrated its effectiveness in a variety of applications. For example, it has been used in the automotive industry for the development of advanced driver assistance systems and in the medical industry for the development of medical devices. Additionally, it has been used in the telecommunications industry for high-speed data transmission and in the consumer electronics industry for the development of smart home appliances.
When using the XC6VLX75T-L1FF784C chip model, it is important to ensure that the application is designed to meet the specific design requirements of the chip model. Additionally, it is important to ensure that the application is designed to be compatible with other components in the system, such as sensors, actuators, and other hardware components. Finally, it is important to ensure that the application is designed to be reliable and secure, as the XC6VLX75T-L1FF784C chip model is designed to offer a high level of performance and scalability.
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3,158 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $871.9420 | $871.9420 |
| 10+ | $862.5662 | $8,625.6624 |
| 100+ | $815.6876 | $81,568.7640 |
| 1000+ | $768.8090 | $384,404.5200 |
| 10000+ | $703.1790 | $703,179.0000 |
| The price is for reference only, please refer to the actual quotation! | ||