AMD Xilinx
XC6VLX130T-L1FF784C
XC6VLX130T-L1FF784C ECAD Model
XC6VLX130T-L1FF784C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 128000 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, FBGA-784 | |
| Pin Count | 784 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VLX130T-L1FF784C Datasheet Download
XC6VLX130T-L1FF784C Overview
The XC6VLX130T-L1FF784C chip model is a powerful, versatile and highly integrated FPGA designed for high performance, low power and low cost applications. It is a low-cost, low-power, low-cost-per-unit FPGA solution that is ideal for any application requiring logic, embedded memory, and high-speed serial connectivity.
The XC6VLX130T-L1FF784C chip model is a highly integrated device with a wide range of features, including: a high-speed transceiver, embedded memory, high-speed logic, and high-speed I/O. It is capable of supporting multiple protocols, including Ethernet, USB, PCI Express, and HDMI. It also features a wide range of configurable I/O, including LVDS, LVCMOS, and differential I/O.
The XC6VLX130T-L1FF784C chip model is designed to provide high-performance, low-power, and low-cost solutions for a wide range of applications. It is ideal for applications such as industrial automation, medical imaging, automotive, and consumer electronics. It is also suitable for applications requiring the integration of multiple functions and protocols, such as networking, storage, and multimedia.
The XC6VLX130T-L1FF784C chip model is a highly versatile FPGA that can be used in a variety of applications. It can be used in networks to provide high-speed, low-power, and low-cost solutions for a wide range of applications. It can also be used in intelligent scenarios for applications such as machine learning and artificial intelligence. Additionally, it is suitable for use in the era of fully intelligent systems, providing the necessary hardware and software support for the development of intelligent applications.
In order to ensure that the XC6VLX130T-L1FF784C chip model meets the specific requirements of a given application, it is important to carefully consider the product description and design requirements. Additionally, it is important to consider actual case studies and potential pitfalls when using the chip model. This will help ensure that the chip model is used in an optimal manner and that it meets the needs of the application.
In conclusion, the XC6VLX130T-L1FF784C chip model is a powerful, versatile and highly integrated FPGA that is ideal for applications requiring logic, embedded memory, and high-speed serial connectivity. It is suitable for use in networks, intelligent scenarios, and the era of fully intelligent systems. By carefully considering the product description and design requirements, as well as actual case studies and potential pitfalls, the chip model can be used in an optimal manner and it can meet the needs of the application.
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5,999 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,067.7888 | $1,067.7888 |
| 10+ | $1,056.3072 | $10,563.0720 |
| 100+ | $998.8992 | $99,889.9200 |
| 1000+ | $941.4912 | $470,745.6000 |
| 10000+ | $861.1200 | $861,120.0000 |
| The price is for reference only, please refer to the actual quotation! | ||