AMD Xilinx
XC6VLX365T-L1FF1156C
XC6VLX365T-L1FF1156C ECAD Model
XC6VLX365T-L1FF1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 364032 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VLX365T-L1FF1156C Datasheet Download
XC6VLX365T-L1FF1156C Overview
The XC6VLX365T-L1FF1156C chip model is a high-performance, versatile model that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming.
The XC6VLX365T-L1FF1156C chip model is designed to be a flexible and powerful model that can be used in a variety of applications. It has a wide range of features and capabilities that make it suitable for a variety of applications. The chip has a high performance processor, a wide range of memory, and a wide range of peripherals. It also has a wide range of interfaces, such as Ethernet, USB, and SPI.
The future development of the chip model and related industries is dependent on the specific technologies that are needed. The chip model is capable of supporting new technologies, such as artificial intelligence and machine learning, as well as traditional technologies, such as embedded systems and digital signal processing.
The XC6VLX365T-L1FF1156C chip model can be applied to the development and popularization of future intelligent robots. It has the potential to be used in a variety of applications, such as robotics, automation, and machine vision. To use the model effectively, technical talents with knowledge of HDL language, embedded systems, and machine learning are needed.
In conclusion, the XC6VLX365T-L1FF1156C chip model is a powerful and flexible model that is suitable for a variety of applications. It is capable of supporting new technologies, such as artificial intelligence and machine learning. It can be used in the development and popularization of future intelligent robots. To use the model effectively, technical talents with knowledge of HDL language, embedded systems, and machine learning are needed.
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1,716 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7,396.0780 | $7,396.0780 |
| 10+ | $7,316.5502 | $73,165.5024 |
| 100+ | $6,918.9116 | $691,891.1640 |
| 1000+ | $6,521.2730 | $3,260,636.5200 |
| 10000+ | $5,964.5790 | $5,964,579.0000 |
| The price is for reference only, please refer to the actual quotation! | ||