XC6VLX240T-L1FF1156C
XC6VLX240T-L1FF1156C
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rohs

AMD Xilinx

XC6VLX240T-L1FF1156C


XC6VLX240T-L1FF1156C
F20-XC6VLX240T-L1FF1156C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, FBGA-1156
35 X 35 MM, FBGA-1156

XC6VLX240T-L1FF1156C ECAD Model


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XC6VLX240T-L1FF1156C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 241152
Combinatorial Delay of a CLB-Max 5.87 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 35 X 35 MM, FBGA-1156
Pin Count 1156
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VLX240T-L1FF1156C Datasheet Download


XC6VLX240T-L1FF1156C Overview



The XC6VLX240T-L1FF1156C chip model is a popular choice for a range of high-performance applications, such as digital signal processing, embedded processing, and image processing. The chip model is designed to be used with hardware description language (HDL) and offers a variety of features and benefits. This article will discuss the advantages of the XC6VLX240T-L1FF1156C chip model, the expected demand trends for the model in related industries, the product description and specific design requirements, and actual case studies and precautions.


The XC6VLX240T-L1FF1156C chip model is a low-power, high-performance FPGA with an array of features, such as high-speed transceivers, high-density logic, and advanced memory support. It is also capable of supporting up to 1,500 user-defined I/O pins and offers a range of power-saving modes. The chip model is designed to be used with HDL, which allows for more efficient design and faster development.


The XC6VLX240T-L1FF1156C chip model is expected to experience increased demand in the coming years as more and more industries adopt this technology. This is due to the fact that the chip model offers a range of features and benefits that make it an attractive option for a variety of applications. For example, the chip model is capable of supporting a wide range of data rates and can be used in a variety of applications, such as digital signal processing, embedded processing, and image processing.


The product description and specific design requirements of the XC6VLX240T-L1FF1156C chip model should be taken into account when designing a project. The product description should include the features and benefits of the chip model, as well as any specific design requirements that need to be taken into account. Additionally, the product description should include any precautions that need to be taken when using the chip model, such as proper power management and cooling.


When designing a project with the XC6VLX240T-L1FF1156C chip model, it is important to consider actual case studies and precautions. This is because the chip model is a complex piece of technology and requires a certain level of knowledge and expertise to use effectively. For example, it is important to consider the power requirements of the chip model, as well as the cooling requirements, in order to ensure that the chip model is used safely and efficiently.


In conclusion, the XC6VLX240T-L1FF1156C chip model is a powerful, low-power, and high-performance FPGA that is suitable for a range of applications. The chip model is designed to be used with HDL and offers a variety of features and benefits. The expected demand for the chip model in related industries is expected to increase in the coming years, and it is important to consider the product description and specific design requirements, as well as actual case studies and precautions, when designing a project with the chip model.



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QTY Unit Price Ext Price
1+ $4,228.3454 $4,228.3454
10+ $4,182.8794 $41,828.7936
100+ $3,955.5490 $395,554.8960
1000+ $3,728.2186 $1,864,109.2800
10000+ $3,409.9560 $3,409,956.0000
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