
AMD Xilinx
XC6VLX240T-L1FF1156C
XC6VLX240T-L1FF1156C ECAD Model
XC6VLX240T-L1FF1156C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 241152 | |
Combinatorial Delay of a CLB-Max | 5.87 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 35 X 35 MM, FBGA-1156 | |
Pin Count | 1156 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6VLX240T-L1FF1156C Datasheet Download
XC6VLX240T-L1FF1156C Overview
The XC6VLX240T-L1FF1156C chip model is a popular choice for a range of high-performance applications, such as digital signal processing, embedded processing, and image processing. The chip model is designed to be used with hardware description language (HDL) and offers a variety of features and benefits. This article will discuss the advantages of the XC6VLX240T-L1FF1156C chip model, the expected demand trends for the model in related industries, the product description and specific design requirements, and actual case studies and precautions.
The XC6VLX240T-L1FF1156C chip model is a low-power, high-performance FPGA with an array of features, such as high-speed transceivers, high-density logic, and advanced memory support. It is also capable of supporting up to 1,500 user-defined I/O pins and offers a range of power-saving modes. The chip model is designed to be used with HDL, which allows for more efficient design and faster development.
The XC6VLX240T-L1FF1156C chip model is expected to experience increased demand in the coming years as more and more industries adopt this technology. This is due to the fact that the chip model offers a range of features and benefits that make it an attractive option for a variety of applications. For example, the chip model is capable of supporting a wide range of data rates and can be used in a variety of applications, such as digital signal processing, embedded processing, and image processing.
The product description and specific design requirements of the XC6VLX240T-L1FF1156C chip model should be taken into account when designing a project. The product description should include the features and benefits of the chip model, as well as any specific design requirements that need to be taken into account. Additionally, the product description should include any precautions that need to be taken when using the chip model, such as proper power management and cooling.
When designing a project with the XC6VLX240T-L1FF1156C chip model, it is important to consider actual case studies and precautions. This is because the chip model is a complex piece of technology and requires a certain level of knowledge and expertise to use effectively. For example, it is important to consider the power requirements of the chip model, as well as the cooling requirements, in order to ensure that the chip model is used safely and efficiently.
In conclusion, the XC6VLX240T-L1FF1156C chip model is a powerful, low-power, and high-performance FPGA that is suitable for a range of applications. The chip model is designed to be used with HDL and offers a variety of features and benefits. The expected demand for the chip model in related industries is expected to increase in the coming years, and it is important to consider the product description and specific design requirements, as well as actual case studies and precautions, when designing a project with the chip model.
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4,306 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,228.3454 | $4,228.3454 |
10+ | $4,182.8794 | $41,828.7936 |
100+ | $3,955.5490 | $395,554.8960 |
1000+ | $3,728.2186 | $1,864,109.2800 |
10000+ | $3,409.9560 | $3,409,956.0000 |
The price is for reference only, please refer to the actual quotation! |