AMD Xilinx
XC6VLX130T-L1FF1156C
XC6VLX130T-L1FF1156C ECAD Model
XC6VLX130T-L1FF1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 128000 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VLX130T-L1FF1156C Datasheet Download
XC6VLX130T-L1FF1156C Overview
The XC6VLX130T-L1FF1156C chip model is a powerful and versatile model that is suitable for a wide range of applications. It is designed with high-performance digital signal processing, embedded processing, and image processing in mind, and it requires the use of HDL language. It has a wide range of features, such as high speed, low power consumption, and a high level of integration. It is also highly reliable and durable, making it an ideal choice for many applications.
The XC6VLX130T-L1FF1156C chip model is expected to be in high demand in the near future, as its features and capabilities make it ideal for many different applications. Its high speed and low power consumption make it suitable for use in a variety of devices, from medical equipment to consumer electronics. Its high level of integration also makes it suitable for use in complex systems, such as those used in autonomous vehicles and intelligent networks.
In terms of future applications, the XC6VLX130T-L1FF1156C chip model is likely to be used in a variety of intelligent scenarios. Its high speed and low power consumption make it suitable for use in networks, where it can be used to process data quickly and efficiently. It can also be used in the era of fully intelligent systems, as its high level of integration makes it suitable for use in complex systems. It can be used to process data in real-time, allowing for the development of sophisticated systems that can respond to changes in their environment.
In conclusion, the XC6VLX130T-L1FF1156C chip model is a powerful and versatile model that is suitable for a wide range of applications. Its features and capabilities make it ideal for use in a variety of scenarios, from medical equipment to consumer electronics. It is also likely to be in high demand in the near future, as its features and capabilities make it suitable for use in networks and in the era of fully intelligent systems.
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3,874 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,225.4424 | $1,225.4424 |
| 10+ | $1,212.2656 | $12,122.6560 |
| 100+ | $1,146.3816 | $114,638.1600 |
| 1000+ | $1,080.4976 | $540,248.8000 |
| 10000+ | $988.2600 | $988,260.0000 |
| The price is for reference only, please refer to the actual quotation! | ||