AMD Xilinx
XC6VCX75T-2FF784C
XC6VCX75T-2FF784C ECAD Model
XC6VCX75T-2FF784C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 74496 | |
| Number of CLBs | 5820 | |
| Combinatorial Delay of a CLB-Max | 910 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, FBGA-784 | |
| Pin Count | 784 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX75T-2FF784C Datasheet Download
XC6VCX75T-2FF784C Overview
The chip model XC6VCX75T-2FF784C is a chip designed by Xilinx, a leading provider of programmable logic solutions. It is a high-performance, low-power, and highly configurable device, which can be used in a wide range of applications, including communication systems, networks, and intelligent systems.
As technology advances, the industry trends of XC6VCX75T-2FF784C and the future development of related industries are constantly changing. It is necessary to understand the original design intention of XC6VCX75T-2FF784C and the possibility of future upgrades in order to make the most of its potential.
XC6VCX75T-2FF784C is designed to meet the needs of high-speed data transmission applications. It can support up to 6.25Gbps data rate, and is also capable of supporting advanced communication systems such as Ethernet, Wi-Fi, and Bluetooth. It can also be used in networks, where it can provide high-speed data transfer, as well as intelligent routing and switching functions.
In the era of fully intelligent systems, XC6VCX75T-2FF784C can be used to develop various intelligent scenarios. It can be used to build intelligent systems that can recognize patterns, detect anomalies, and make decisions. It can also be used to develop systems that can interact with users, and understand natural language.
XC6VCX75T-2FF784C is a powerful and versatile chip that can be used in a variety of applications. It has the potential to be used in advanced communication systems, networks, and intelligent systems. With its high performance, low power consumption, and highly configurable features, it is well-suited for the future of technology.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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