AMD Xilinx
XC6VCX75T-1FF784C
XC6VCX75T-1FF784C ECAD Model
XC6VCX75T-1FF784C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 74496 | |
| Number of CLBs | 5820 | |
| Combinatorial Delay of a CLB-Max | 790 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5,2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 29 X 29 MM, FBGA-784 | |
| Pin Count | 784 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VCX75T-1FF784C Datasheet Download
XC6VCX75T-1FF784C Overview
The chip model XC6VCX75T-1FF784C is a state-of-the-art chip model from Xilinx, Inc. It is a powerful, high-performance FPGA device that is designed to meet the needs of a wide variety of applications. It features a high-performance Virtex-6 FPGA core, which is capable of supporting up to 75 million logic elements and up to 1 million flip-flops. The device also has a high-speed transceiver, which can support up to 10.3125 Gbps data rates.
The XC6VCX75T-1FF784C has a wide range of applications, from consumer electronics to industrial automation. The device has the capability to support multiple protocols, such as Ethernet, Serial RapidIO, and PCI Express. This makes it an ideal choice for applications that require high-speed data transfer. The device also supports a variety of memory interfaces, including DDR2, DDR3, and QDR. This makes it suitable for applications that require high-speed memory access.
The XC6VCX75T-1FF784C is expected to see increased demand in the future, as the demand for high-performance devices continues to grow. This is due to the increasing need for devices that can support the latest technologies, such as 5G and IoT. The device is also expected to be used in the development of advanced communication systems, as it is capable of providing the high-speed data transfer that is needed for these systems.
The original design intention of the XC6VCX75T-1FF784C was to provide a high-performance device that could meet the needs of a wide variety of applications. The device has the capability to support multiple protocols and memory interfaces, making it an ideal choice for applications that require high-speed data transfer. The device also has the capability to be upgraded in the future, as new technologies are developed.
The XC6VCX75T-1FF784C is also suitable for the development and popularization of future intelligent robots. The device has the capability to support multiple protocols and memory interfaces, making it an ideal choice for applications that require high-speed data transfer. The device also has the capability to be upgraded in the future, as new technologies are developed. In order to use the XC6VCX75T-1FF784C effectively, it is important to have the right technical talent. Having a team of experienced engineers who are familiar with the device and its capabilities is essential for successful development and deployment of the device.
In conclusion, the XC6VCX75T-1FF784C is a powerful, high-performance FPGA device that is designed to meet the needs of a wide variety of applications. It is expected to see increased demand in the future, as the demand for high-performance devices continues to grow. The device is also suitable for the development and popularization of future intelligent robots, and having the right technical talent is essential for successful development and deployment of the device.
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3,961 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $577.4742 | $577.4742 |
| 10+ | $571.2648 | $5,712.6480 |
| 100+ | $540.2178 | $54,021.7800 |
| 1000+ | $509.1708 | $254,585.4000 |
| 10000+ | $465.7050 | $465,705.0000 |
| The price is for reference only, please refer to the actual quotation! | ||